San Jose, California
United States
14
2016-07-28
The entities that hold a legal rights for patent applications filed by inventor Robinson Marc E.:
Marc E. Robinson from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY
#2 | 2016-04-14Semiconductor die mount by conformal die coating
#3 | 2014-07-31Semiconductor die mount by conformal die coating
#4 | 2013-08-15Assembly having stacked die mounted on substrate
#5 | 2013-04-25Support mounted electrically interconnected die assembly
#6 | 2011-02-17Electrically interconnected stacked die assemblies
#7 | 2010-05-13Sensor
#8 | 2010-03-04Image Sensor
#9 | 2009-09-17Support mounted electrically interconnected die assembly
#10 | 2009-04-23CHIP SCALE STACKED DIE PACKAGE
#11 | 2009-03-12Semiconductor die mount by conformal die coating
#12 | 2008-12-11Electrically interconnected stacked die assemblies
#13 | 2007-12-13Assembly having stacked die mounted on substrate
#14 | 2007-11-01Die assembly having electrical interconnect
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