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Inventor profile of:

Kai-Ming YANG

City:

Hsinchu County

Country:

Taiwan

Published Applications:

Last publication date:

2025-10-16

Top Assignees for applications by Kai-Ming YANG

The entities that hold a legal rights for patent applications filed by inventor YANG Kai-Ming:

UNIMICRON TECHNOLOGY CORP. 28 TAOYUAN, Taiwan
Unimicron Technology Corp. 26 Taoyuan City, Taiwan

Recent patent applications by YANG Kai-Ming

Kai-Ming YANG from Hsinchu County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-10-16

US20250323232A1

Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

#2 | 2025-05-08

US20250149426A1

Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

#3 | 2024-12-12

US20240413067A1

Electricity

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

#4 | 2024-07-25

US20240251504A1

Electricity

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

#5 | 2024-07-25

US20240248264A1

Physics

PACKAGE STRUCTURE

#6 | 2024-07-11

US20240237209A9

Electricity

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

#7 | 2024-07-11

US20240237202A9

Electricity

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

#8 | 2024-04-25

US20240138063A1

Electricity

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

#9 | 2024-04-25

US20240138059A1

Electricity

Circuit board structure and manufacturing method thereof

#10 | 2024-01-11

US20240014145A1

Electricity

Integrated circuit package structure

#11 | 2023-07-27

US20230240023A1

Electricity

Circuit board structure and manufacturing method thereof

#12 | 2023-06-15

US20230187598A1

Electricity

Light-emitting diode package structure and manufacturing method thereof

#13 | 2023-06-08

US20230178520A1

Electricity

LIGHT-EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

#14 | 2022-11-29

US17371114

Electricity

Circuit board structure and manufacturing method thereof

#15 | 2022-11-24

US20220375919A1

Electricity

MANUFACTURING METHOD OF PACKAGE STRUCTURE

#16 | 2022-11-17

US20220367307A1

Electricity

Manufacturing method of chip package structure

#17 | 2022-10-27

US20220344248A1

Electricity

Package structure and manufacturing method thereof

#18 | 2022-10-20

US20220336333A1

Electricity

Package structure and manufacturing method thereof

#19 | 2022-10-13

US20220328387A1

Electricity

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

#20 | 2022-08-11

US20220256717A1

Electricity

Circuit board structure and manufacturing method thereof

#21 | 2022-08-04

US20220246810A1

Electricity

Package structure and manufacturing method thereof

#22 | 2022-06-30

US20220208631A1

Electricity

Chip package structure and manufacturing method thereof

#23 | 2022-06-30

US20220208630A1

Electricity

Chip packaging structure and manufacturing method thereof

#24 | 2022-05-05

US20220139886A1

Electricity

Light-emitting package and method of manufacturing the same

#25 | 2022-04-28

US20220131054A1

Electricity

LIGHT-EMITTING PACKAGE AND METHOD OF MANUFACTURING THE SAME

#26 | 2022-04-07

US20220108953A1

Electricity

Package structure and manufacturing method thereof

#27 | 2022-03-03

US20220069489A1

Electricity

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

#28 | 2022-03-03

US20220068872A1

Electricity

Electronic device bonding structure and fabrication method thereof

#29 | 2022-03-03

US20220068742A1

Electricity

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

#30 | 2022-02-24

US20220061157A1

Electricity

Wiring board and method of forming hole thereof

#31 | 2021-09-23

US20210296291A1

Electricity

Chip package structure and manufacturing method thereof

#32 | 2021-09-09

US20210282275A1

Electricity

Wiring board and manufacturing method thereof

#33 | 2021-06-24

US20210195761A1

Electricity

Manufacturing method of package structure

#34 | 2020-05-14

US20200154578A1

Electricity

Circuit substrate

#35 | 2020-02-27

US20200068721A1

Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

#36 | 2019-12-05

US20190373713A1

Electricity

Stacked structure and method for manufacturing the same

#37 | 2019-08-01

US20190239362A1

Electricity

Package structure and manufacturing method thereof

#38 | 2019-03-28

US20190098746A1

Electricity

Method for forming circuit board stacked structure

#39 | 2018-11-15

US20180332700A1

Electricity

Circuit board stacked structure and method for forming the same

#40 | 2017-12-28

US20170374748A1

Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

InventorID:

2078983 ⎘