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Assignee profile:

UNIMICRON TECHNOLOGY CORP.

City:

TAOYUAN

Country:

Taiwan

Published Applications:

448

Last publication date:

2025-09-11

Patent Grants:

416

Last grant date:

2026-06-09

Quarterly UNIMICRON TECHNOLOGY CORP. Patent Applications

Top Inventors for applications by UNIMICRON TECHNOLOGY CORP.

These are the the leading inventors for applications assigned to UNIMICRON TECHNOLOGY CORP.:

Recent patent applications by UNIMICRON TECHNOLOGY CORP.

UNIMICRON TECHNOLOGY CORP. based in TAOYUAN, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2025-09-11 ✅ Patent 12,652,752 granted on 2026-06-09
US20250287497A1
Electricity

CIRCUIT BOARD DEVICE

 #2 | 2025-05-29 ✅ Patent 12,422,456 granted on 2025-09-23
US20250172587A1
Physics

PROBE CARD

 #3 | 2025-03-13 ✅ Patent 12,557,219 granted on 2026-02-17
US20250089173A1
Electricity

CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF

 #4 | 2024-11-21 ✅ Patent 12,414,235 granted on 2025-09-09
US20240389232A1
Electricity

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

 #5 | 2024-11-14 ✅ Patent 12,396,100 granted on 2025-08-19
US20240381533A1
Electricity

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

 #6 | 2024-11-14 ✅ Patent 12,504,591 granted on 2025-12-23
US20240377598A1
Physics

CO-PACKAGED STRUCTURE FOR OPTICS AND ELECTRICS

 #7 | 2024-10-24 ✅ Patent 12,250,776 granted on 2025-03-11
US20240357748A1
Electricity

Substrate structure and cutting method thereof

 #8 | 2024-09-19 ✅ Patent 12,292,468 granted on 2025-05-06
US20240310428A1
Physics

Inspection system and inspection method of bare circuit board

 #9 | 2024-09-12 ✅ Patent 12,563,667 granted on 2026-02-24
US20240306298A1
Electricity

MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE

 #10 | 2024-07-11 ✅ Patent 12,160,953 granted on 2024-12-03
US20240237202A9
Electricity

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

 #11 | 2024-05-30 ✅ Patent 12,550,246 granted on 2026-02-10
US20240179829A1
Electricity

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

 #12 | 2024-04-25 ✅ Patent 12,369,250 granted on 2025-07-22
US20240138063A1
Electricity

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

 #13 | 2024-04-25 ✅ Patent 12,160,953 granted on 2024-12-03
US20240138059A1
Electricity

Circuit board structure and manufacturing method thereof

 #14 | 2024-04-18 ✅ Patent 12,133,323 granted on 2024-10-29
US20240130038A1
Electricity

Transmission device for suppressing glass fiber effect

 #15 | 2024-04-18 ✅ Patent 12,315,981 granted on 2025-05-27
US20240128626A1
Electricity

Transmission line device compriing first and second conductive lines on one level separated from a third conductive line on another level by an intervening ground layer

 #16 | 2024-04-18 ✅ Patent 12,525,522 granted on 2026-01-13
US20240128179A1
Electricity

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

 #17 | 2024-04-11 ✅ Patent 12,396,095 granted on 2025-08-19
US20240121896A1
Electricity

CIRCUIT BOARD WITH LOW GRAIN BOUNDARY DENSITY AND FORMING METHOD THEREOF

 #18 | 2024-04-04 ✅ Patent 12,426,168 granted on 2025-09-23
US20240114632A1
Electricity

CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

 #19 | 2024-03-28 ✅ Patent 12,666,992 granted on 2026-06-23
US20240105661A1
Electricity

CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME

 #20 | 2024-02-22 ✅ Patent 12,324,100 granted on 2025-06-03
US20240064901A1
Electricity

Circuit board assembly and manufacturing method thereof

 #21 | 2024-01-18 ✅ Patent 12,439,529 granted on 2025-10-07
US20240023251A1
Electricity

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

 #22 | 2024-01-11 ✅ Patent 12,266,616 granted on 2025-04-01
US20240014145A1
Electricity

Integrated circuit package structure

 #23 | 2023-12-28 ✅ Patent 12,347,912 granted on 2025-07-01
US20230420818A1
Electricity

MULTI-LAYERED RESONATOR CIRCUIT STRUCTURE AND MULTI-LAYERED FILTER CIRCUIT STRUCTURE

 #24 | 2023-12-14 ✅ Patent 12,412,879 granted on 2025-09-09
US20230402441A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #25 | 2023-12-14 ✅ Patent 12,525,542 granted on 2026-01-13
US20230402391A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #26 | 2023-12-14 ✅ Patent 11,860,428 granted on 2024-01-02
US20230400649A1
Physics

Package structure and optical signal transmitter

 #27 | 2023-11-30 ✅ Patent 12,052,815 granted on 2024-07-30
US20230389172A1
Electricity

Manufacturing method of circuit board

 #28 | 2023-11-16 ✅ Patent 12,328,828 granted on 2025-06-10
US20230371189A1
Electricity

METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE

 #29 | 2023-10-19 ✅ Patent 12,628,656 granted on 2026-05-12
US20230335506A1
Electricity

ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

 #30 | 2023-10-19 ✅ Patent 12,469,769 granted on 2025-11-11
US20230335466A1
Electricity

ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

 #31 | 2023-10-05 ✅ Patent 12,022,612 granted on 2024-06-25
US20230319990A1
Electricity

Circuit board and manufacturing method thereof

 #32 | 2023-10-05 ✅ Patent 12,253,727 granted on 2025-03-18
US20230314738A1
Physics

Electronic device

 #33 | 2023-09-14 ✅ Patent 11,924,961 granted on 2024-03-05
US20230292428A1
Electricity

Circuit board and method of manufacturing the same

 #34 | 2023-09-14 ✅ Patent 12,184,005 granted on 2024-12-31
US20230291139A1
Electricity

Connector and method for manufacturing the same

 #35 | 2023-09-07 ✅ Patent 11,792,922 granted on 2023-10-17
US20230284376A1
Electricity

Electronic circuit assembly and method for manufacturing thereof

 #36 | 2023-08-24 ✅ Patent 12,506,056 granted on 2025-12-23
US20230268257A1
Electricity

ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #37 | 2023-08-24 ✅ Patent 12,557,711 granted on 2026-02-17
US20230268256A1
Electricity

ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #38 | 2023-08-17 ✅ Patent 12,219,711 granted on 2025-02-04
US20230262900A1
Electricity

Bare circuit board

 #39 | 2023-08-17 ✅ Patent 12,144,113 granted on 2024-11-12
US20230262890A1
Electricity

Circuit board structure

 #40 | 2023-08-17 ✅ Patent 12,256,488 granted on 2025-03-18
US20230262880A1
Electricity

Circuit board structure

 #41 | 2023-07-27 ✅ Patent 11,943,877 granted on 2024-03-26
US20230240023A1
Electricity

Circuit board structure and manufacturing method thereof

 #42 | 2023-07-27 ✅ Patent 11,910,535 granted on 2024-02-20
US20230240014A1
Electricity

Printed circuit board stack structure and manufacturing method thereof

 #43 | 2023-07-27 ✅ Patent 11,937,366 granted on 2024-03-19
US20230239997A1
Electricity

Circuit signal enhancement method of circuit board and structure thereof

 #44 | 2023-07-20 ✅ Patent 12,062,742 granted on 2024-08-13
US20230231087A1
Electricity

Package structure and manufacturing method of the same

 #45 | 2023-07-13 ✅ Patent 12,108,530 granted on 2024-10-01
US20230225050A1
Electricity

Circuit board structure and manufacturing method thereof

 #46 | 2023-07-06 ✅ Patent 12,218,017 granted on 2025-02-04
US20230215772A1
Electricity

Glass carrier having protection structure and manufacturing method thereof

 #47 | 2023-06-15 ✅ Patent 12,255,279 granted on 2025-03-18
US20230187598A1
Electricity

Light-emitting diode package structure and manufacturing method thereof

 #48 | 2023-06-08 ✅ Patent 11,997,785 granted on 2024-05-28
US20230180382A1
Electricity

Circuit board

 #49 | 2023-05-25 ✅ Patent 12,185,479 granted on 2024-12-31
US20230164928A1
Electricity

Flexible circuit board and manufacturing method thereof

 #50 | 2023-05-18 ✅ Patent 11,895,773 granted on 2024-02-06
US20230156918A1
Electricity

Circuit board structure

 #51 | 2023-05-18 ✅ Patent 11,737,206 granted on 2023-08-22
US20230156909A1
Electricity

Circuit board structure

 #52 | 2023-05-18 ✅ Patent 11,818,833 granted on 2023-11-14
US20230156908A1
Electricity

Circuit board structure

 #53 | 2023-05-04 ✅ Patent 12,309,943 granted on 2025-05-20
US20230137841A1
Electricity

Circuit carrier and manufacturing method thereof and package structure

 #54 | 2023-04-20 ✅ Patent 11,859,302 granted on 2024-01-02
US20230124913A1
Chemistry; metallurgy

Electroplating apparatus and electroplating method

 #55 | 2023-04-20 ✅ Patent 11,686,008 granted on 2023-06-27
US20230124732A1
Chemistry; metallurgy

Electroplating apparatus and electroplating method

 #56 | 2023-04-13 ✅ Patent 11,923,350 granted on 2024-03-05
US20230116522A1
Electricity

Light emitting diode package structure

 #57 | 2023-03-30 ✅ Patent 11,670,520 granted on 2023-06-06
US20230102457A1
Electricity

Package structure with interconnection between chips and packaging method thereof

 #58 | 2023-03-23 ✅ Patent 12,089,347 granted on 2024-09-10
US20230092278A1
Electricity

Method of improving wire structure of circuit board and improving wire structure of circuit board

 #59 | 2023-02-23 ✅ Patent 11,792,939 granted on 2023-10-17
US20230058180A1
Electricity

Substrate with buried component and manufacture method thereof

 #60 | 2023-02-16 ✅ Patent 12,200,861 granted on 2025-01-14
US20230046699A1
Electricity

Circuit board structure

 #61 | 2023-02-14 ✅ Patent 11,579,178 granted on 2023-02-14
US17647012
Physics

Inspection apparatus for bare circuit board

 #62 | 2022-12-22 ✅ Patent 11,991,837 granted on 2024-05-21
US20220408567A1
Electricity

Circuit board and manufacturing method thereof

 #63 | 2022-12-22 ✅ Patent 11,690,173 granted on 2023-06-27
US20220408554A1
Electricity

Circuit board structure

 #64 | 2022-12-01 ✅ Patent 11,895,772 granted on 2024-02-06
US20220386460A1
Electricity

Interlayer connective structure of wiring board and method of manufacturing the same

 #65 | 2022-11-29 ✅ Patent 11,516,910 granted on 2022-11-29
US17371114
Electricity

Circuit board structure and manufacturing method thereof

 #66 | 2022-11-24 ✅ Patent 12,588,135 granted on 2026-03-24
US20220377874A1
Electricity

METHOD OF MANUFACTURING CIRCUIT BOARD

 #67 | 2022-11-24 ✅ Patent 12,414,243 granted on 2025-09-09
US20220375919A1
Electricity

MANUFACTURING METHOD OF PACKAGE STRUCTURE

 #68 | 2022-11-17 ✅ Patent 11,637,047 granted on 2023-04-25
US20220367307A1
Electricity

Manufacturing method of chip package structure

 #69 | 2022-10-27 ✅ Patent 11,682,612 granted on 2023-06-20
US20220344248A1
Electricity

Package structure and manufacturing method thereof

 #70 | 2022-10-20 ✅ Patent 11,710,690 granted on 2023-07-25
US20220336333A1
Electricity

Package structure and manufacturing method thereof

 #71 | 2022-10-06 ✅ Patent 11,641,713 granted on 2023-05-02
US20220322529A1
Electricity

Circuit board structure and manufacturing method thereof

 #72 | 2022-09-08 ✅ Patent 11,488,900 granted on 2022-11-01
US20220285255A1
Electricity

Wiring board with interposer substrate surrounded by underfill and embedded in main substrate and method of fabricating the same

 #73 | 2022-08-25 ✅ Patent 11,955,587 granted on 2024-04-09
US20220271208A1
Electricity

Light emitting diode package structure and manufacturing method thereof and manufacturing method of display device

 #74 | 2022-08-11 ✅ Patent 11,665,832 granted on 2023-05-30
US20220256717A1
Electricity

Circuit board structure and manufacturing method thereof

 #75 | 2022-08-04 ✅ Patent 11,764,344 granted on 2023-09-19
US20220246810A1
Electricity

Package structure and manufacturing method thereof

 #76 | 2022-07-28 ✅ Patent 11,737,209 granted on 2023-08-22
US20220240369A1
Electricity

Circuit board and manufacturing method thereof and electronic device

 #77 | 2022-07-28 ✅ Patent 11,792,918 granted on 2023-10-17
US20220240368A1
Electricity

Co-axial via structure

 #78 | 2022-07-28 ✅ Patent 11,715,715 granted on 2023-08-01
US20220238471A1
Electricity

Metal bump structure and manufacturing method thereof and driving substrate

 #79 | 2022-07-21 ✅ Patent 11,477,886 granted on 2022-10-18
US20220232702A1
Electricity

Circuit board structure and spliced circuit board

 #80 | 2022-07-21 ✅ Patent 12,177,964 granted on 2024-12-24
US20220232695A1
Electricity

Circuit board and manufacturing method thereof and electronic device

 #81 | 2022-07-21 ✅ Patent 11,785,707 granted on 2023-10-10
US20220232694A1
Electricity

Circuit board and manufacturing method thereof and electronic device

 #82 | 2022-07-21 ✅ Patent 11,837,591 granted on 2023-12-05
US20220231004A1
Electricity

Manufacturing method of light emitting diode package structure

 #83 | 2022-07-21 ✅ Patent 12,057,381 granted on 2024-08-06
US20220230949A1
Electricity

Circuit board having laminated build-up layers

 #84 | 2022-07-07 ✅ Patent 11,483,925 granted on 2022-10-25
US20220217841A1
Electricity

Circuit board and manufacture method of the circuit board

 #85 | 2022-06-30 ✅ Patent 11,462,452 granted on 2022-10-04
US20220208631A1
Electricity

Chip package structure and manufacturing method thereof

 #86 | 2022-06-30 ✅ Patent 11,764,120 granted on 2023-09-19
US20220208630A1
Electricity

Chip packaging structure and manufacturing method thereof

 #87 | 2022-06-23 ✅ Patent 11,637,060 granted on 2023-04-25
US20220199513A1
Electricity

Wiring board and method of manufacturing the same

 #88 | 2022-06-16 ✅ Patent 11,430,768 granted on 2022-08-30
US20220189923A1
Electricity

Stacked die chip package structure and method of manufacturing the same

 #89 | 2022-06-02 ✅ Patent 11,556,196 granted on 2023-01-17
US20220171482A1
Physics

Display device

 #90 | 2022-05-19 ✅ Patent 12,156,325 granted on 2024-11-26
US20220159824A1
Electricity

Package carrier with improved heat dissipation efficiency and manufacturing method thereof

 #91 | 2022-05-12 ✅ Patent 11,460,255 granted on 2022-10-04
US20220146207A1
Mechanical engineering

Vapor chamber device and manufacturing method thereof

 #92 | 2022-05-05 ✅ Patent 11,682,658 granted on 2023-06-20
US20220139886A1
Electricity

Light-emitting package and method of manufacturing the same

 #93 | 2022-04-28 ✅ Patent 12,243,838 granted on 2025-03-04
US20220130781A1
Electricity

Circuit substrate structure and manufacturing method thereof

 #94 | 2022-04-28 ✅ Patent 11,531,433 granted on 2022-12-20
US20220129113A1
Physics

Manufacturing method of touch display device

 #95 | 2022-04-07 ✅ Patent 11,410,933 granted on 2022-08-09
US20220108953A1
Electricity

Package structure and manufacturing method thereof

 #96 | 2022-04-07 ✅ Patent 11,631,626 granted on 2023-04-18
US20220108934A1
Electricity

Package structure

 #97 | 2022-03-24 ✅ Patent 11,641,720 granted on 2023-05-02
US20220095464A1
Electricity

Circuit board and manufacturing method thereof

 #98 | 2022-03-17 ✅ Patent 12,016,133 granted on 2024-06-18
US20220087033A1
Electricity

Circuit board with a conductive bump mounted on an adhesive layer

 #99 | 2022-03-03 ✅ Patent 11,540,396 granted on 2022-12-27
US20220071015A1
Electricity

Circuit board structure and manufacturing method thereof

 #100 | 2022-03-03 ✅ Patent 11,991,824 granted on 2024-05-21
US20220071010A1
Electricity

Circuit board structure and manufacturing method thereof

Also check out Unimicron Technology Corp.'s (Taoyuan, Taiwan) applicant profile with 293 patent applications submitted.

AssigneeID:

3410 ⎘