Inventor profile of:

Prabhat Kumar

City:

Fremont, California

Country:

United States

Published Applications:

27

Last publication date:

2025-01-09

Top Assignees for applications by Prabhat Kumar

The entities that hold a legal rights for patent applications filed by inventor Kumar Prabhat:

Recent patent applications by Kumar Prabhat

Prabhat Kumar from Fremont, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-09
US20250014909A1
Electricity

SELECTIVE ETCH USING FLUOROCARBON-BASED DEPOSITION OF A METALLOID OR METAL

#2 | 2023-08-24
US20230268192A1
Electricity

IN-SITU HYDROCARBON-BASED LAYER FOR NON-CONFORMAL PASSIVATION OF PARTIALLY ETCHED STRUCTURES

#3 | 2022-05-19
US20220157574A1
Electricity

RING FOR SUBSTRATE EXTREME EDGE PROTECTION

#4 | 2018-11-29
US20180342422A1
Electricity

Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process

#5 | 2017-10-17
US15154790
Electricity

Etch mask for hybrid laser scribing and plasma etch wafer singulation process

#6 | 2016-10-27
US20160315009A1
Electricity

UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach

#7 | 2016-05-31
US14589918
Electricity

Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process

#8 | 2016-02-18
US20160049313A1
Electricity

Method of outgassing a mask material deposited over a workpiece in a process tool

#9 | 2016-01-28
US20160027697A1
Electricity

Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process

#10 | 2015-10-13
US14589913
Electricity

Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach

#11 | 2015-09-22
US14320426
Electricity

Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination

#12 | 2015-09-08
US14320405
Electricity

Hybrid dicing process using a blade and laser

#13 | 2015-08-18
US14276683
Electricity

Dicing tape thermal management by wafer frame support ring cooling during plasma dicing

#14 | 2015-08-06
US20150221505A1
Electricity

Wafer coating

#15 | 2015-07-30
US20150214111A1
Electricity

Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing

#16 | 2015-07-07
US14248165
Electricity

Residue removal from singulated die sidewall

#17 | 2015-06-11
US20150162243A1
Electricity

Screen print mask for laser scribe and plasma etch wafer dicing process

#18 | 2015-03-31
US14169502
Electricity

Wafer coating

#19 | 2015-01-06
US14167548
Electricity

Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing

#20 | 2014-09-18
US20140273338A1
Electricity

Methods of forming solar cells and solar cell modules

#21 | 2014-09-18
US20140261666A1
Electricity

METHODS OF MANUFACTURING A LOW COST SOLAR CELL DEVICE

#22 | 2014-03-06
US20140060609A1
Electricity

MONOLITHIC MODULE ASSEMBLY FOR STANDARD CRYSTALLINE SILICON SOLAR CELLS

#23 | 2013-09-12
US20130233379A1
Electricity

PATTERNED ALUMINUM BACK CONTACTS FOR REAR PASSIVATION

#24 | 2013-07-18
US20130183796A1
Electricity

Methods of manufacturing solar cell devices

#25 | 2013-04-25
US20130102109A1
Electricity

METHOD AND APPARATUS OF REMOVING A PASSIVATION FILM AND IMPROVING CONTACT RESISTANCE IN REAR POINT CONTACT SOLAR CELLS

#26 | 2012-10-25
US20120270359A1
Electricity

METHOD OF FORMING P-N JUNCTION IN SOLAR CELL SUBSTRATE

#27 | 2012-09-13
US20120227794A1
Electricity

THRESHOLD ADJUSTMENT IMPLANTS FOR REDUCING SURFACE RECOMBINATION IN SOLAR CELLS

InventorID:

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