Pleasanton, California
United States
29
2021-07-22
The entities that hold a legal rights for patent applications filed by inventor FU XINYU:
XINYU FU from Pleasanton, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Methods for depositing fluorine/carbon-free conformal tungsten
#2 | 2019-03-21Methods of depositing metal films using metal oxyhalide precursors
#3 | 2018-03-29Process kit shield for improved particle reduction
#4 | 2018-03-08Method of enabling seamless cobalt gap-fill
#5 | 2017-07-06Methods for depositing fluorine/carbon-free conformal tungsten
#6 | 2017-05-25Methods for forming low-resistance contacts through integrated process flow systems
#7 | 2017-03-23Method of enabling seamless cobalt gap-fill
#8 | 2017-03-02Methods of depositing metal films using metal oxyhalide precursors
#9 | 2016-11-17Tungsten films by organometallic or silane pre-treatment of substrate
#10 | 2016-11-03Methods for selective deposition of metal silicides via atomic layer deposition cycles
#11 | 2016-09-22Methods for etching via atomic layer deposition (ALD) cycles
#12 | 2016-08-25Method of enabling seamless cobalt gap-fill
#13 | 2016-05-12Methods for thermally forming a selective cobalt layer
#14 | 2016-04-14Methods for depositing fluorine/carbon-free conformal tungsten
#15 | 2015-04-02Method of enabling seamless cobalt gap-fill
#16 | 2014-10-02Method for removing native oxide and associated residue from a substrate
#17 | 2014-09-18Integrated platform for fabricating n-type metal oxide semiconductor (NMOS) devices
#18 | 2014-05-01Methods for depositing fluorine/carbon-free conformal tungsten
#19 | 2014-01-09Post deposition treatments for CVD cobalt films
#20 | 2013-11-28Method for removing native oxide and associated residue from a substrate
#21 | 2013-10-03Method of enabling seamless cobalt gap-fill
#22 | 2013-07-25Methods for forming a contact metal layer in semiconductor devices
#23 | 2013-06-20Methods for annealing a contact metal layer to form a metal silicidation layer
#24 | 2013-06-04Method for removing native oxide and associated residue from a substrate
#25 | 2013-04-25Methods for forming a metal gate structure on a substrate
#26 | 2012-10-04Post deposition treatments for CVD cobalt films
#27 | 2012-03-22Methods for forming layers on a substrate
#28 | 2011-11-17Process kit shield for improved particle reduction
#29 | 2010-07-01Method for improving electromigration lifetime of copper interconnection by extended post anneal
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