Gilbert, Arizona
United States
9
2026-04-02
The entities that hold a legal rights for patent applications filed by inventor BAKER MICHAEL J.:
MICHAEL J. BAKER from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:
WAFER LEVEL MULTI FORM FACTOR DIE SINGULATION
#2 | 2025-06-26HANDLING ASSEMBLY, HANDLING SYSTEM AND METHOD
#3 | 2022-06-23CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
#4 | 2022-06-23Carrier for microelectronic assemblies having direct bonding
#5 | 2022-06-23CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
#6 | 2021-12-02STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
#7 | 2019-07-11STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
#8 | 2018-03-01SPACE-EFFICIENT UNDERFILLING TECHNIQUES FOR ELECTRONIC ASSEMBLIES
#9 | 2017-08-08Space-efficient underfilling techniques for electronic assemblies
2131059 ⎘