Inventor profile of:

Aravind Dasu

City:

Milpitas, California

Country:

United States

Published Applications:

19

Last publication date:

2024-10-17

Top Assignees for applications by Aravind Dasu

The entities that hold a legal rights for patent applications filed by inventor Dasu Aravind:

Recent patent applications by Dasu Aravind

Aravind Dasu from Milpitas, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-10-17
US20240347514A1
Electricity

STACKED DIE NETWORK INTERFACE CONTROLLER CIRCUITRY

#2 | 2024-05-02
US20240145395A1
Electricity

INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB

#3 | 2023-04-06
US20230107106A1
Electricity

Interconnect architecture with silicon interposer and EMIB

#4 | 2022-12-22
US20220405005A1
Physics

Three dimensional circuit systems and methods having memory hierarchies

#5 | 2021-10-07
US20210313991A1
Electricity

Circuit systems and methods for reducing power supply voltage droop

#6 | 2021-10-07
US20210313988A1
Electricity

Three dimensional programmable logic circuit systems and methods

#7 | 2021-10-07
US20210311537A1
Physics

Supply Voltage Control Systems And Methods For Integrated Circuits

#8 | 2021-10-07
US20210311517A1
Physics

Voltage regulator circuit systems and methods

#9 | 2020-11-26
US20200374102A1
Electricity

Active interposer for localized programmable integrated circuit reconfiguration

#10 | 2020-10-15
US20200328192A1
Electricity

Stacked die network interface controller circuitry

#11 | 2020-07-02
US20200211969A1
Electricity

Interconnect architecture with silicon interposer and EMIB

#12 | 2019-07-25
US20190229888A1
Electricity

Active interposer for localized programmable integrated circuit reconfiguration

#13 | 2019-02-07
US20190043782A1
Electricity

CONFIGURABLE WICKLESS CAPILLARY-DRIVEN CONSTRAINED VAPOR BUBBLE (CVB) HEAT PIPE STRUCTURES

#14 | 2019-01-10
US20190012116A1
Physics

Data storage for accelerating functions

#15 | 2018-07-26
US20180211900A1
Electricity

Techniques for fluid cooling of integrated circuits in packages

#16 | 2018-06-21
US20180176006A1
Electricity

Active interposer for localized programmable integrated circuit reconfiguration

#17 | 2018-05-24
US20180143860A1
Physics

METHODS AND APPARATUS FOR PROGRAMMABLE INTEGRATED CIRCUIT COPROCESSOR SECTOR MANAGEMENT

#18 | 2018-05-24
US20180143777A1
Physics

Programmable integrated circuit with stacked memory die for storing configuration data

#19 | 2018-03-29
US20180090417A1
Electricity

Fluid routing devices and methods for cooling integrated circuit packages

InventorID:

2154129 ⎘