Bend, Oregon
United States
12
2018-03-29
The entities that hold a legal rights for patent applications filed by inventor Kellar Scot A.:
Scot A. Kellar from Bend, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Integrated circuit package having rectangular aspect ratio
#2 | 2007-09-18Capacitor with insulating nanostructure
#3 | 2007-05-17Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
#4 | 2007-01-02Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
#5 | 2006-06-06Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack
#6 | 2006-05-02Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration
#7 | 2005-12-13Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof
#8 | 2005-09-08Capacitor with conducting nanostructure
#9 | 2005-07-14Ultra-high capacitance device based on nanostructures
#10 | 2005-06-28Ultra-high capacitance device based on nanostructures
#11 | 2005-05-12Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode
#12 | 2005-05-03Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same
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