Bayan Baru
Malaysia
8
2026-01-29
The entities that hold a legal rights for patent applications filed by inventor Foo Loke Yip:
Loke Yip Foo from Bayan Baru, MY has applied for patents for these inventions. The list has both pending applications and granted patents:
Chiplet Interconnect for High Bandwidth Memory Devices
#2 | 2025-01-16FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS WITH REDISTRIBUTION LAYER PACKAGING AND METHODS OF ASSEMBLING SAME
#3 | 2023-05-04Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same
#4 | 2021-12-16Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same
#5 | 2021-04-01Embedded dual-sided interconnect bridges for integrated-circuit packages
#6 | 2020-03-12Power delivery for embedded interconnect bridge devices and methods
#7 | 2019-10-03Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same
#8 | 2018-03-29Interconnection of an embedded die
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