Wei Ming Lim

City:

Bayan Lepas

Country:

Malaysia

Published Applications:

Last publication date:

2019-03-28

Top Assignees for applications by Wei Ming Lim

The entities that hold a legal rights for patent applications filed by inventor Lim Wei Ming:

Wei Ming Lim from Bayan Lepas, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

Test architecture for die to die interconnect for three dimensional integrated circuits

Methods and apparatus for predictable protocol aware testing on memory interface

InventorID:

2159192 ⎘