Altadena, California
United States
26
2016-01-28
The entities that hold a legal rights for patent applications filed by inventor Bridger Paul:
Paul Bridger from Altadena, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Fabrication of semiconductor device using alternating high and low temperature layers
#2 | 2015-12-10Fabrication of III-Nitride Power Semiconductor Device
#3 | 2015-02-05Fabrication of III-nitride semiconductor device and related structures
#4 | 2014-04-17Fabrication of III-nitride semiconductor device and related structures
#5 | 2014-02-06III-nitride semiconductor device with stepped gate
#6 | 2013-10-10III-nitride heterojunction device
#7 | 2013-10-03III-nitride heterojunction device
#8 | 2013-05-02Active area shaping for III-nitride devices
#9 | 2011-06-16III-nitride monolithic IC
#10 | 2008-11-06III-nitride semiconductor device with trench structure
#11 | 2007-12-20III-nitride device and method with variable epitaxial growth direction
#12 | 2007-08-02Integrated III-nitride devices
#13 | 2007-04-26III-nitride device with improved layout geometry
#14 | 2007-04-05Method for fabricating a semiconductor device
#15 | 2007-04-05Complimentary lateral III-nitride transistors
#16 | 2007-03-15Process for manufacture of super lattice using alternating high and low temperature layers to block parasitic current path
#17 | 2006-12-14Structure and method for III-nitride monolithic power IC
#18 | 2006-10-05Structure and method for III-nitride device isolation
#19 | 2006-04-20III-nitride power semiconductor device with a current sense electrode
#20 | 2005-09-01III-nitride device and method with variable epitaxial growth direction
#21 | 2005-08-18Complimentary lateral nitride transistors
#22 | 2005-08-18Complimentary nitride transistors vertical and common drain
#23 | 2005-07-07III-nitride semiconductor device with trench structure
#24 | 2005-06-30Void isolated III-nitride device
#25 | 2005-06-30III-nitride device with improved layout geometry
#26 | 2005-06-09Structure and method for III-nitride monolithic power IC
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