Inventor profile of:

Alex Gritti

City:

Vimercate

Country:

Italy

Published Applications:

17

Last publication date:

2026-02-12

Top Assignees for applications by Alex Gritti

The entities that hold a legal rights for patent applications filed by inventor Gritti Alex:

Recent patent applications by Gritti Alex

Alex Gritti from Vimercate, IT has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-02-12
US20260047460A1
Electricity

ELECTRONIC DEVICE INCLUDING A PACKAGE WITH A CAP COUPLED TO A SUBSTRATE WITH AN IMPROVED RESILIENCE TO THE DELAMINATION AND RELATED MANUFACTURING PROCESS

#2 | 2026-02-12
US20260047449A1
Electricity

LEAD-FRAME PACKAGE UTILIZING INTEGRATED INSULATING LAYER FOR INTEGRATED CIRCUIT INSULATION

#3 | 2025-10-16
US20250320114A1
Performing operations; transporting

PACKAGE FOR MULTIPLE LOUDSPEAKERS

#4 | 2025-04-17
US20250123478A1
Physics

INTEGRATED ELECTRONIC MODULE INCLUDING TWO MICROMIRRORS, AND SYSTEM INCLUDING THE ELECTRONIC MODULE

#5 | 2025-03-27
US20250102391A1
Physics

PRESSURE SENSOR WITH FLANGE

#6 | 2023-06-01
US20230171911A1
Electricity

ELECTRONIC MODULE CARRYING A PLURALITY OF ELECTRONIC DEVICES

#7 | 2022-07-28
US20220238485A1
Electricity

PACKAGED ELECTRONIC SYSTEM FORMED BY ELECTRICALLY CONNECTED AND GALVANICALLY ISOLATED DICE

#8 | 2022-03-31
US20220099957A1
Physics

Integrated electronic module including two micromirrors, and system including the electronic module

#9 | 2022-02-03
US20220033251A1
Performing operations; transporting

Electronic device and corresponding method

#10 | 2021-04-01
US20210098355A1
Electricity

Semiconductor package with wettable slot structures

#11 | 2018-05-31
US20180149538A1
Physics

Multi-transducer modulus, electronic apparatus including the multi-transducer modulus and method for manufacturing the multi-transducer modulus

#12 | 2017-01-05
US20170006368A1
Electricity

Microelectromechanical microphone

#13 | 2015-08-06
US20150217993A1
Performing operations; transporting

Shielded encapsulating structure and manufacturing method thereof

#14 | 2014-05-15
US20140131819A1
Performing operations; transporting

Process for manufacturing a lid for an electronic device package, and lid for an electronic device package

#15 | 2013-05-02
US20130105952A1
Performing operations; transporting

Shielded encapsulating structure and manufacturing method thereof

#16 | 2012-06-21
US20120153771A1
Electricity

Microelectromechanical transducer and corresponding assembly process

#17 | 2007-03-29
US20070069391A1
Electricity

Stacked die semiconductor package

InventorID:

217688 ⎘