Kirkop
Malta
41
2024-04-25
38
2025-07-15
These are the the leading inventors for applications assigned to STMicroelectronics (Malta) Ltd:
STMicroelectronics (Malta) Ltd based in Kirkop, MT has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
#2 | 2024-02-01SEMICONDUCTOR PACKAGING WITH TRANSPARENCY AND METHOD OF MANUFACTURING THE SAME
#3 | 2023-06-01 ✅ Patent 12,362,213 granted on 2025-07-15TRAY CARRIER AND CORRESPONDING METHOD
#4 | 2023-04-13 ✅ Patent 12,017,910 granted on 2024-06-25Method of manufacturing electronic devices and corresponding electronic device
#5 | 2023-02-16 ✅ Patent 12,494,419 granted on 2025-12-09INTEGRATED CIRCUIT PACKAGE WITH WARPAGE CONTROL USING CAVITY FORMED IN LAMINATED SUBSTRATE BELOW THE INTEGRATED CIRCUIT DIE
#6 | 2023-01-05 ✅ Patent 12,148,628 granted on 2024-11-19Semiconductor device and corresponding method
#7 | 2021-07-01 ✅ Patent 11,622,183 granted on 2023-04-04Microelectromechanical microphone
#8 | 2021-06-03 ✅ Patent 11,443,958 granted on 2022-09-13Semiconductor device and corresponding method
#9 | 2021-04-01 ✅ Patent 11,309,237 granted on 2022-04-19Semiconductor package with wettable slot structures
#10 | 2020-10-01 ✅ Patent 11,524,892 granted on 2022-12-13Method of manufacturing electronic devices and corresponding electronic device
#11 | 2020-10-01 ✅ Patent 11,352,251 granted on 2022-06-07Electronic device and corresponding manufacturing method
#12 | 2020-06-11 ✅ Patent 10,892,201 granted on 2021-01-12Electronic device comprising a support substrate and an encapsulating cover for an electronic component
#13 | 2019-12-12 ✅ Patent 10,882,738 granted on 2021-01-05Wafer level package for a mems sensor device and corresponding manufacturing process
#14 | 2019-06-20 ✅ Patent 10,870,207 granted on 2020-12-22Barrel cap attach trays
#15 | 2019-05-23 ✅ Patent 10,431,514 granted on 2019-10-01Semiconductor packages having dual encapsulation material
#16 | 2019-05-09 ✅ Patent 11,032,629 granted on 2021-06-08Microelectromechanical microphone
#17 | 2019-03-21 ✅ Patent 10,600,704 granted on 2020-03-24Electronic device comprising a support substrate and an encapsulating cover for an electronic component
#18 | 2018-07-12 ✅ Patent 10,357,964 granted on 2019-07-23Microfluidic assembly and methods of forming same
#19 | 2018-02-15 ✅ Patent 10,435,290 granted on 2019-10-08Wafer level package for a MEMS sensor device and corresponding manufacturing process
#20 | 2017-08-17 ✅ Patent 9,950,511 granted on 2018-04-24Microfluidic assembly and methods of forming same
#21 | 2017-05-04 ✅ Patent 9,698,040 granted on 2017-07-04Semiconductor device carrier tape with image sensor detectable dimples
#22 | 2017-01-05 ✅ Patent 10,225,635 granted on 2019-03-05Microelectromechanical microphone
#23 | 2016-12-22METHOD OF MANUFACTURING ELECTRONIC COMPONENTS AND CORRESPONDING ELECTRONIC COMPONENT
#24 | 2016-09-20 ✅ Patent 9,449,912 granted on 2016-09-20Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming
#25 | 2016-09-08 ✅ Patent 9,769,554 granted on 2017-09-19Semiconductor integrated device for acoustic applications with contamination protection element, and manufacturing method thereof
#26 | 2016-06-30 ✅ Patent 9,802,813 granted on 2017-10-31Wafer level package for a MEMS sensor device and corresponding manufacturing process
#27 | 2016-04-21 ✅ Patent 10,329,143 granted on 2019-06-25Package with chambers for dies and manufacturing process thereof
#28 | 2016-03-31 ✅ Patent 9,527,727 granted on 2016-12-27Packages for semiconductor devices and methods for assembling same
#29 | 2015-12-17 ✅ Patent 9,401,349 granted on 2016-07-26Stack of integrated-circuit chips and electronic device
#30 | 2015-08-20 ✅ Patent 9,620,438 granted on 2017-04-11Electronic device with heat dissipater
#31 | 2015-05-28 ✅ Patent 9,290,377 granted on 2016-03-22Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device
#32 | 2014-12-04 ✅ Patent 9,446,943 granted on 2016-09-20Wafer-level packaging of integrated devices, and manufacturing method thereof
#33 | 2014-04-03 ✅ Patent 9,257,372 granted on 2016-02-09Surface mount package for a semiconductor integrated device, related assembly and manufacturing process
#34 | 2013-04-04 ✅ Patent 9,390,988 granted on 2016-07-12Method for soldering a cap to a support layer
#35 | 2012-06-21 ✅ Patent 8,837,754 granted on 2014-09-16Microelectromechanical transducer and corresponding assembly process
#36 | 2012-02-09 ✅ Patent 8,546,895 granted on 2013-10-01Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
#37 | 2011-04-07 ✅ Patent 8,043,881 granted on 2011-10-25Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
#38 | 2010-05-06 ✅ Patent 8,618,676 granted on 2013-12-31Method of assembly of a semiconductor package for the improvement of the electrical testing yield on the packages so obtained
#39 | 2010-02-04 ✅ Patent 8,742,562 granted on 2014-06-03Electronic device protected against electro static discharge
#40 | 2008-07-31 ✅ Patent 7,875,942 granted on 2011-01-25Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
#41 | 2008-06-05 ✅ Patent 8,633,583 granted on 2014-01-21Semiconductor package substrate and methods for forming same, in particular for MEMS devices
Also check out STMICROELECTRONICS (MALTA) LTD's (Kirkop, Malta) applicant profile with 33 patent applications submitted.
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