Giovanni Capuz

City:

Boutersem

Country:

Belgium

Published Applications:

Last publication date:

2020-12-24

Top Assignees for applications by Giovanni Capuz

The entities that hold a legal rights for patent applications filed by inventor Capuz Giovanni:

Giovanni Capuz from Boutersem, BE has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for the electrical bonding of semiconductor components

Method for bonding semiconductor chips to a landing wafer

InventorID:

2186791 ⎘