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Inventor profile of:

Devarajan Balaraman

City:

Apex, North Carolina

Country:

United States

Published Applications:

26

Last publication date:

2026-05-21

Top Assignees for applications by Devarajan Balaraman

The entities that hold a legal rights for patent applications filed by inventor Balaraman Devarajan:

Recent patent applications by Balaraman Devarajan

Devarajan Balaraman from Apex, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-21
US20260144143A1
Electricity

Power Semiconductor Device Package

 #2 | 2026-05-21
US20260144063A1
Electricity

Power Semiconductor Device Package

 #3 | 2026-04-09
US20260101814A1
Electricity

Power Semiconductor Device Package

 #4 | 2026-02-19
US20260053057A1
Electricity

ENCAPSULATION DELAMINATION PREVENTION STRUCTURES AT DIE EDGE

 #5 | 2025-12-04
US20250372520A1
Electricity

POWER DISCRETE PACKAGE HAVING SYMMETRIC PINOUTS AND PROCESS OF IMPLEMENTING THE SAME

 #6 | 2025-10-16
US20250323130A1
Electricity

Wafer-Level Bond-Line Control

 #7 | 2025-05-22
US20250167007A1
Electricity

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD THEREOF

 #8 | 2025-05-08
US20250149432A1
Electricity

PACKAGED ELECTRONIC DEVICES HAVING DIELECTRIC SUBSTRATES WITH THERMALLY CONDUCTIVE ADHESIVE LAYERS

 #9 | 2025-04-17
US20250125231A1
Electricity

Direct Bonded Semiconductor Die Package

 #10 | 2025-04-17
US20250122413A1
Chemistry; metallurgy

Multifunctional Adhesion Promoter for Semiconductor Device Packages

 #11 | 2025-03-27
US20250105196A1
Electricity

Semiconductor Die Bonding

 #12 | 2025-01-30
US20250038055A1
Electricity

Submounts with Stud Protrusions for Semiconductor Packages

 #13 | 2024-12-19
US20240421029A1
Electricity

Semiconductor Package

 #14 | 2024-10-24
US20240355738A1
Electricity

Power Semiconductor Devices Including Beryllium Metallization

 #15 | 2024-08-22
US20240282741A1
Electricity

Metal Nitride Core-Shell Particle Die-Attach Material

 #16 | 2024-08-15
US20240274514A1
Electricity

Electroless Die-Attach Process for Semiconductor Packaging

 #17 | 2024-08-01
US20240258217A1
Electricity

SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPROVED ADHESION

 #18 | 2024-07-18
US20240243031A1
Electricity

Thermal Enhanced Power Semiconductor Package

 #19 | 2024-06-06
US20240182757A1
Chemistry; metallurgy

Core-Shell Particle Die-Attach Material

 #20 | 2023-08-17
US20230260861A1
Electricity

Semiconductor packages with increased power handling

 #21 | 2022-07-28
US20220238426A1
Electricity

Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers

 #22 | 2021-02-11
US20210043465A1
Electricity

Electronic device with top side pin array and manufacturing method thereof

 #23 | 2019-09-12
US20190279882A1
Electricity

Electronic device with top side pin array and manufacturing method thereof

 #24 | 2019-04-11
US20190109018A1
Electricity

Electronic device with top side pin array and manufacturing method thereof

 #25 | 2018-11-08
US20180323161A1
Electricity

Semiconductor device and method of manufacturing thereof

 #26 | 2018-05-17
US20180138138A1
Electricity

Semiconductor device and method of manufacturing thereof
InventorID:

2192987 ⎘