Phoenix, Arizona
United States
9
2024-12-26
The entities that hold a legal rights for patent applications filed by inventor AU Hinmeng:
Hinmeng AU from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME
#2 | 2024-02-01Multi-chip package and method of providing die-to-die interconnects in same
#3 | 2023-01-19Multi-chip package and method of providing die-to-die interconnects in same
#4 | 2021-05-06Multi-chip package and method of providing die-to-die interconnects in same
#5 | 2020-11-12Multi-chip package and method of providing die-to-die interconnects in same
#6 | 2020-03-05Multi-chip package and method of providing die-to-die interconnects in same
#7 | 2018-05-24Multi-chip package and method of providing die-to-die interconnects in same
#8 | 2012-10-18Multi-chip package and method of providing die-to-die interconnects in same
#9 | 2010-12-30Multi-chip package and method of providing die-to-die interconnects in same
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