Inventor profile of:

JUNWOO PARK

City:

SUWON-SI

Country:

South Korea

Published Applications:

18

Last publication date:

2026-02-12

Top Assignees for applications by JUNWOO PARK

The entities that hold a legal rights for patent applications filed by inventor PARK JUNWOO:

Recent patent applications by PARK JUNWOO

JUNWOO PARK from SUWON-SI, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-02-12
US20260047475A1
Electricity

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

#2 | 2026-02-05
US20260040979A1
Electricity

SEMICONDUCTOR PACKAGE

#3 | 2026-01-08
US20260011689A1
Electricity

SEMICONDUCTOR PACKAGE

#4 | 2025-10-23
US20250330333A1
Electricity

METHOD AND ELECTRONIC DEVICE FOR CONFIGURING NETWORK LOCK FUNCTION OF ELECTRONIC DEVICE

#5 | 2025-07-03
US20250218800A1
Electricity

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BOARD HAVING A PATTERN

#6 | 2025-06-12
US20250191986A1
Electricity

SEMICONDUCTOR PACKAGES INCLUDING MOLDING GUIDE PATTERNS

#7 | 2025-04-17
US20250125229A1
Electricity

SEMICONDUCTOR DEVICE

#8 | 2025-02-06
US20250046663A1
Electricity

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

#9 | 2024-12-19
US20240420972A1
Electricity

SEMICONDUCTOR MOLDING APPARATUS AND COMPRESSION MOLDING METHOD USING THE SAME

#10 | 2024-04-18
US20240128190A1
Electricity

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

#11 | 2024-03-21
US20240096748A1
Electricity

CHIP PROTECTION DEVICE

#12 | 2024-03-07
US20240079342A1
Electricity

SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME

#13 | 2023-12-21
US20230411259A1
Electricity

SEMICONDUCTOR PACKAGE

#14 | 2023-12-07
US20230395482A1
Electricity

SEMICONDUCTOR PACKAGE

#15 | 2023-11-23
US20230378094A1
Electricity

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME

#16 | 2020-03-26
US20200098734A1
Electricity

Semiconductor package

#17 | 2019-02-28
US20190067258A1
Electricity

Semiconductor package having a molding layer including a molding cavity and method of fabricating the same

#18 | 2018-05-24
US20180145061A1
Electricity

Semiconductor package

InventorID:

2198745 ⎘