Cory A. Runyan

City:

Folsom, California

Country:

United States

Published Applications:

Last publication date:

2020-09-24

Top Assignees for applications by Cory A. Runyan

The entities that hold a legal rights for patent applications filed by inventor Runyan Cory A.:

Cory A. Runyan from Folsom, US has applied for patents for these inventions. The list has both pending applications and granted patents:

High density multiple die structure

Microelectronic device stacks having interior window wirebonding

3D CHIP ASSEMBLIES USING STACKED LEADFRAMES

3D chip assemblies using stacked leadframes

InventorID:

2209961 ⎘