Chandler, Arizona
United States
14
2019-12-26
The entities that hold a legal rights for patent applications filed by inventor Krishnan Arjun:
Arjun Krishnan from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:
ENCAPSULANT MATERIAL CONTAINING FLUOROPHORES FOR IN-SITU VISUALIZATION OF STRESS IN AN ORGANIC PACKAGE
#2 | 2017-06-29Mold compound with reinforced fibers
#3 | 2017-04-11Stiffener tape for electronic assembly that includes wafer or panel
#4 | 2016-08-18Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
#5 | 2016-06-16Stiffener tape for electronic assembly
#6 | 2016-06-16Narrow-gap flip chip underfill composition
#7 | 2015-06-25Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
#8 | 2015-06-25Narrow-gap flip chip underfill composition
#9 | 2015-06-18Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
#10 | 2014-12-25Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
#11 | 2014-09-18Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
#12 | 2014-09-18Methods of forming wafer level underfill materials and structures formed thereby
#13 | 2014-06-26Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
#14 | 2013-05-02THERMOPLASTIC POLYMER COMPOSITIONS WITH PROGRAMMABLE END-OF-LIFE AND METHOD OF MAKING THE SAME
222578 ⎘