Ya Ping WANG

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2020-03-26

Top Assignees for applications by Ya Ping WANG

The entities that hold a legal rights for patent applications filed by inventor WANG Ya Ping:

Ya Ping WANG from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor chip fabrication and packaging methods thereof

Fabrication method of packaging structure

Semiconductor chip, and fabrication and packaging methods thereof

Packaging structure and fabrication method thereof

INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH LEAD OVERLAP AND METHOD OF MANUFACTURE THEREOF

Charger slipcover and handheld device

Integrated circuit package system with support structure for die overhang

Pick-up heads and systems for die bonding and related applications

InventorID:

2230076 ⎘