Inventor profile of:

Gunter Grasshoff

City:

Radebeul

Country:

Germany

Published Applications:

22

Last publication date:

2019-10-10

Top Assignees for applications by Gunter Grasshoff

The entities that hold a legal rights for patent applications filed by inventor Grasshoff Gunter:

Recent patent applications by Grasshoff Gunter

Gunter Grasshoff from Radebeul, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-10-10
US20190312042A1
Electricity

Semiconductor devices having silicon/germanium active regions with different germanium concentrations

#2 | 2019-10-10
US20190312041A1
Electricity

Semiconductor devices including Si/Ge active regions with different Ge concentrations

#3 | 2019-02-07
US20190043764A1
Electricity

Semiconductor devices and manufacturing techniques for reduced aspect ratio of neighboring gate electrode lines

#4 | 2018-10-16
US15617388
Electricity

Semiconductor device comprising trench isolation

#5 | 2017-11-23
US20170338343A1
Electricity

HIGH-VOLTAGE TRANSISTOR DEVICE

#6 | 2016-03-03
US20160064228A1
Electricity

Method of forming a semiconductor structure including a ferroelectric material and semiconductor structure including a ferroelectric transistor

#7 | 2016-02-25
US20160056263A1
Electricity

Methods of forming a gate cap layer above a replacement gate structure

#8 | 2013-07-18
US20130181265A1
Electricity

Methods of Forming a Gate Cap Layer Above a Replacement Gate Structure and a Semiconductor Device That Includes Such a Gate Structure and Cap Layer

#9 | 2013-06-20
US20130157432A1
Electricity

Enhancing integrity of a high-K gate stack by protecting a liner at the gate bottom during gate head exposure

#10 | 2013-05-02
US20130109174A1
Electricity

Methods of forming conductive structures using a spacer erosion technique

#11 | 2012-03-13
US12959943
-

Etch methods for semiconductor device fabrication

#12 | 2011-02-03
US20110024805A1
Electricity

Using high-k dielectrics as highly selective etch stop materials in semiconductor devices

#13 | 2010-06-03
US20100136762A1
Electricity

Enhancing integrity of a high-k gate stack by protecting a liner at the gate bottom during gate head exposure

#14 | 2010-02-04
US20100025742A1
Electricity

TRANSISTOR HAVING A STRAINED CHANNEL REGION CAUSED BY HYDROGEN-INDUCED LATTICE DEFORMATION

#15 | 2009-12-31
US20090321843A1
Electricity

CMOS device comprising MOS transistors with recessed drain and source areas and a SI/GE material in the drain and source areas of the PMOS transistor

#16 | 2009-03-05
US20090057769A1
Electricity

Method of forming CMOS device having gate insulation layers of different type and thickness

#17 | 2007-10-04
US20070232006A1
Electricity

Method for forming embedded strained drain/source regions based on a combined spacer and cavity etch process

#18 | 2006-02-28
US10447877
-

Signal layer for generating characteristic optical plasma emissions

#19 | 2005-11-29
US10744439
-

Method of adjusting etch selectivity by adapting aspect ratios in a multi-level etch process

#20 | 2005-04-12
US10283891
-

Advanced process control for a manufacturing process of a plurality of products with minimized control degradation after re-initialization upon occurrence of reset events

#21 | 2005-04-05
US10359980
-

Methods for producing a highly doped electrode for a field effect transistor

#22 | 2005-01-04
US10128662
-

System and method for wafer-based controlled patterning of features with critical dimensions

InventorID:

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