Ken P. HACKENBERG

City:

Plano, Texas

Country:

United States

Published Applications:

Last publication date:

2021-06-24

Top Assignees for applications by Ken P. HACKENBERG

The entities that hold a legal rights for patent applications filed by inventor HACKENBERG Ken P.:

Ken P. HACKENBERG from Plano, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Full package vapor chamber with IHS

Sintered solder for fine pitch first-level interconnect (FLI) applications

COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME

COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME

Sintered solder for fine pitch first-level interconnect (FLI) applications

InventorID:

2236748 ⎘