Tempe, Arizona
United States
25
2024-01-11
The entities that hold a legal rights for patent applications filed by inventor Chatterjee Prithwish:
Prithwish Chatterjee from Tempe, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DIELECTRICS
#2 | 2023-10-31Substrate integrated thin film capacitors using amorphous high-k dielectrics
#3 | 2022-09-08Coreless electronic substrates having embedded inductors
#4 | 2022-07-21MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES
#5 | 2022-04-28Methods of embedding magnetic structures in substrates
#6 | 2022-03-03Coreless organic packages with embedded die and magnetic inductor structures
#7 | 2022-01-13ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL TO FORM INDUCTORS
#8 | 2021-09-02IN-PLANE INDUCTORS IN IC PACKAGES
#9 | 2020-12-31SUBSTRATE FOR AN ELECTRONIC DEVICE
#10 | 2020-09-03Coreless organic packages with embedded die and magnetic inductor structures
#11 | 2020-06-04SUBSTRATE EMBEDDED HEAT PIPE
#12 | 2020-05-28Asymmetric cored integrated circuit package supports
#13 | 2020-03-05Coreless organic packages with embedded die and magnetic inductor structures
#14 | 2020-01-02Methods for attaching large components in a package substrate for advanced power delivery
#15 | 2020-01-02Substrate integrated thin film capacitors using amorphous high-k dielectrics
#16 | 2020-01-02SUBSTRATE ASSEMBLY REGION WITH CERAMIC OR BORON FIBER
#17 | 2020-01-02Patterning of thin film capacitors in organic substrate packages
#18 | 2019-09-26Enabling magnetic films in inductors integrated into semiconductor packages
#19 | 2019-09-12Thin film barrier seed metallization in magnetic-plugged through hole inductor
#20 | 2019-07-18Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates
#21 | 2019-07-04Magnetic inductor structures for package devices
#22 | 2019-07-04Electronic substrates having embedded dielectric magnetic material to form inductors
#23 | 2019-06-27Methods of embedding magnetic structures in substrates
#24 | 2019-06-27Electronic substrates having embedded magnetic material using photo-imagable dielectric layers
#25 | 2018-08-23Edible supercapacitors
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