Portland, Oregon
United States
14
2025-10-30
The entities that hold a legal rights for patent applications filed by inventor Kulkarni Devdatta P.:
Devdatta P. Kulkarni from Portland, US has applied for patents for these inventions. The list has both pending applications and granted patents:
LIQUID COOLED MODULE FOR NARROW PITCH SLOTS
#2 | 2025-09-11COMPACT FORM FACTOR FLUID FLOW REGULATOR
#3 | 2025-01-16COOLING MASS AND SPRING ELEMENT FOR LOW INSERTION FORCE HOT SWAPPABLE ELECTRONIC COMPONENT INTERFACE
#4 | 2022-07-14THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS
#5 | 2022-06-30Cooling mass and spring element for low insertion force hot swappable electronic component interface
#6 | 2021-10-14LIQUID COOLED MODULE FOR NARROW PITCH SLOTS
#7 | 2019-07-04Thermal management component
#8 | 2019-03-28METHODS OF DIRECT COOLING OF PACKAGED DEVICES AND STRUCTURES FORMED THEREBY
#9 | 2019-03-21Mechanism with folded wrapping to seal components immersed in coolant
#10 | 2019-01-03Methods of direct cooling of packaged devices and structures formed thereby
#11 | 2018-11-29Two-phase liquid-vapor computer cooling device
#12 | 2018-09-20COOLING USING A WICK WITH VARIED THICKNESS
#13 | 2018-09-13Hydraulic bladder for CPU interconnection and cooling
#14 | 2018-09-06System with provision of a thermal interface to a printed circuit board
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