Jeremy D. Ecton

PLATED MAGNETIC VIA FOR GLASS CORE

GLASS SUBSTRATE WITH CAVITY AND SEEDLESS THROUGH-GLASS VIAS

SELECTIVE POROUS GLASS FOR GLASS SUBSTRATE SINGULATION

METHODS AND SYSTEMS FOR FORMING INTEGRATED CIRCUIT PACKAGES COMPRISING GLASS LAYERS WITH THIN SINGULATED PORTIONS

EDGE COATING FOR GLASS CORE SUBSTRATE WITH A FRAME

EDGE COATING FOR GLASS CORE SUBSTRATE WITH AIR PRESSING FOR PROFILE CONTROL

GLASS CORE SUBSTRATE WITH EDGE BIAS

SINGULATION INCORPORATING AN ETCHED METAL CHANNEL

EMBEDDED CHANNELS IN A GLASS CORE

SOCKET ASSEMBLIES FOR SEMICONDUCTOR DEVICES

GLASS PACKAGE WITH LIQUID METAL SOCKETING

INVERTED GLASS INTERPOSER WITH GLASS STIFFENER

FRAMES FOR GLASS CORE HYBRID PANELS

Microelectronic Glass-Containing Core Layer Including Clamp Structure

TOOLING HOLE FOR HYBRID PANEL ASSEMBLY

PACKAGE SUBSTRATES WITH CORES HAVING SOLID GLASS AND GLASS FIBER PREPREG

INORGANIC RECONSTITUTION CARRIER PANEL

RIVETED EDGE CORE FOR SEMICONDUCTOR PACKAGING

OPTICAL AND ELECTRICAL GLASS INTERPOSER WITH EMBEDDED BRIDGE

METHODS AND ARCHITECTURES FOR SHALLOW FIDUCIAL AND METAL DEFINED PAD DESIGNS

INTERCONNECTIONS TO PACKAGE SUBSTRATES FOR INTERCONNECT BRIDGES

MULTI-DIE BRIDGE ASSEMBLIES AND METHODS FOR THREE-DIMENSIONAL PACKAGING

Technologies for Components Embedded in a Substrate Core

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE

SELF ALIGNMENT STRUCTURES FOR INTERCONNECT BRIDGES

TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE

SPACER FOR EMBEDDED COMPONENT IN CORE

PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRATE CORE

RECONSTITUTED PASSIVE WITH MECHANICAL SUPPORT STRUCTURES

MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES

APPARATUS AND METHODS FOR EMBEDDING DEEP TRENCH CAPACITOR (DTC) COMPONENTS IN A SUBSTRATE

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES

CONTROLLING SUBSTRATE BUMP HEIGHT

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION

EMBEDDED ORGANIC BRIDGE COMPONENT FOR SEMICONDUCTOR PACKAGES

CONDITIONING SEMICONDUCTOR PROCESSING SOLUTIONS FOR REUSE

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER

TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING

TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE

GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES

INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES

ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER

ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES

ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS

LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD

CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE

GLASS LAYER WITH LITHO DEFINED THROUGH-GLASS VIA

MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE THEREIN

Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG)

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG)

RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES

GLASS EMBEDDED TRUE AIR CORE INDUCTORS

PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE

REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED COMPONENT

BUMPLESS HYBRID ORGANIC GLASS INTERPOSER

HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE

METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS

MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER

PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE

IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS

SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES

IC PACKAGE WITH LEDS

TECHNOLOGIES FOR GLASS CORE INDUCTOR

COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS

THREE-DIMENSIONAL INTEGRATION OF DIES IN AN INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE INCLUDING GLASS INTERPOSER STRUCTURE WITH SELF-ALIGNED THROUGH GLASS VIAS

CAVITY-LESS INTERCONNECT COMPONENT ON GLASS CORE

GLASS DIE-TO-DIE BRIDGE AND INTERPOSER FOR DIE FIRST ARCHITECTURE

SELF-ALIGNMENT OF GLASS CORE HALVES USING PROTRUDED BUMPS

THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES

PACKAGE ARCHITECTURES WITH GLASS CORES FOR THICKNESS REDUCTION AND 3D INTEGRATION

CONFORMABLE DIE BOND FILM (DBF) IN GLASS CAVITY

SKIP LAYER WITH AIR GAP ON GLASS SUBSTRATES

ANGLED BAFFLES ON GLASS EDGE FOR CAVITATION PROTECTION

ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES

SINX BASED SURFACE FINISH ARCHITECTURE

SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS

POCKETED COPPER IN FIRST LAYER INTERCONNECT AND METHOD

SILICON NITRIDE LAYER UNDER A COPPER PAD

GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS

GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS

STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER

ORGANIC THIN-FILMS FOR DATA TRANSMISSION

NO-REMELT SOLDER ENFORCEMENT JOINT

INTEGRATED, CONFIGURABLE, TRIANGULAR MICROCHANNEL HEAT PUMP

OMNI DIRECTIONAL INTERCONNECT WITH MAGNETIC FILLERS IN MOLD MATRIX

GLASS PATCH INTEGRATION INTO AN ELECTRONIC DEVICE PACKAGE

MICROELECTRONIC PACKAGE WITH DIELECTRIC LAYER INCLUDING SELF-ASSEMBLED FILLER-DEPLETED REGIONS

DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM A SURFACE OF THE GLASS

INTEGRATED, CONFIGURABLE MICRO HEAT PUMP AND MICROCHANNELS

ELECTRONIC PACKAGING ARCHITECTURE WITH CUSTOMIZED VARIABLE METAL THICKNESS ON SAME BUILDUP LAYER

EMBEDDED GLASS CORE PATCH