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Inventor profile of:

Amanda E. Schuckman

City:

Chandler, Arizona

Country:

United States

Published Applications:

9

Last publication date:

2023-07-13

Top Assignees for applications by Amanda E. Schuckman

The entities that hold a legal rights for patent applications filed by inventor Schuckman Amanda E.:

  • INTEL CORPORATION 7 Santa Clara, CA United States

Recent patent applications by Schuckman Amanda E.

Amanda E. Schuckman from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-07-13
US20230223278A1
Electricity

High density organic interconnect structures

#2 | 2022-02-24
US20220059367A1
Electricity

High density organic interconnect structures

#3 | 2020-10-01
US20200312675A1
Electricity

High density organic interconnect structures

#4 | 2019-11-21
US20190355642A1
Electricity

Semiconductor device including silane based adhesion promoter and method of making

#5 | 2019-08-08
US20190244922A1
Electricity

NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME

#6 | 2019-07-18
US20190221447A1
Electricity

High density organic interconnect structures

#7 | 2018-11-08
US20180323138A1
Electricity

REDUNDANT THROUGH-HOLE INTERCONNECT STRUCTURES

#8 | 2018-10-04
US20180288885A1
Electricity

Electronic assembly that includes void free holes

#9 | 2018-04-24
US15463523
Electricity

Metal protected fan-out cavity

InventorID:

2316872 ⎘

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