Fei Guo

City:

Ottawa

Country:

Canada

Published Applications:

Last publication date:

2026-03-26

Top Assignees for applications by Fei Guo

The entities that hold a legal rights for patent applications filed by inventor Guo Fei:

Fei Guo from Ottawa, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

Chip-to-Chip High Speed Connection Interface Tuning Structure

Anti-resonance structure for dampening die package resonance

High density cross link die with polymer routing layer

Anti-resonance structure for dampening die package resonance

Interposer-based damping resistor

Data transmission with power supply noise compensation

InventorID:

2333655 ⎘