Wei-Ping Wang

City:

Taichung

Country:

Taiwan

Published Applications:

Last publication date:

2024-09-26

Top Assignees for applications by Wei-Ping Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Wei-Ping:

Siliconware Precision Industries Co., Ltd. 10 Taichung, Taiwan
SILICONWARE PRECISION INDUSTRIES CO., LTD. 1 Taichung City, Taiwan

Recent patent applications by Wang Wei-Ping

Wei-Ping Wang from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-09-26

US20240321591A1

Electricity

METHOD FOR FABRICATING ELECTRONIC PACKAGE

#2 | 2023-10-26

US20230343603A1

Electricity

Electronic package and method for fabricating the same

#3 | 2021-05-13

US20210143021A1

Electricity

Method for fabricating electronic package

#4 | 2020-05-28

US20200168523A1

Electricity

Electronic package, method for fabricating the same, and heat dissipator

#5 | 2018-10-04

US20180286701A1

Electricity

Electronic package and method for fabricating the same

#6 | 2018-09-13

US20180261552A1

Electricity

Method for fabricating electronic package having a protruding barrier frame

#7 | 2018-02-08

US20180040568A1

Electricity

Electronic package having a protruding barrier frame

#8 | 2016-01-14

US20160013074A1

Electricity

Fabrication method of packaging substrate

#9 | 2015-04-02

US20150091150A1

Electricity

Package on package structure and fabrication method thereof

#10 | 2013-05-09

US20130115738A1

Electricity

Packaging substrate and fabrication method thereof

InventorID:

235285 ⎘