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Assignee profile:

Siliconware Precision Industries Co., Ltd.

City:

Taichung

Country:

Taiwan

Published Applications:

688

Last publication date:

2026-02-12

Patent Grants:

524

Last grant date:

2026-01-13

Quarterly Siliconware Precision Industries Co., Ltd. Patent Applications

Top Inventors for applications by Siliconware Precision Industries Co., Ltd.

These are the the leading inventors for applications assigned to Siliconware Precision Industries Co., Ltd.:

Chien-Ping Huang 92 Taichung, Taiwan
Chih-Hsien Chiu 58 Taichung, Taiwan
Chang-Fu Lin 55 Taichung, Taiwan
Chun-Chi Ke 42 Taichung, Taiwan

Cheng-Hsu Hsiao 40 Taichung Hsien, Taiwan
Shih-Kuang Chiu 38 Taichung, Taiwan
Chih-Ming Huang 33 Taichung, Taiwan
Chun-Tang Lin 32 Taichung, Taiwan

Cheng-Hsu Hsiao 28 Taichung, Taiwan
Wen-Jung Tsai 27 Taichung, Taiwan
Chia-Chu Lai 27 Taichung, Taiwan
Chia-Yang Chen 26 Taichung, Taiwan

Chang-Fu Lin 25 Taichung City, Taiwan
Chi-Ching Ho 24 Taichung, Taiwan
Yu-Cheng Pai 24 Taichung, Taiwan
Chien-Ping Huang 23 Hsinchu Hsein, Taiwan

Fu-Tang Huang 23 Taichung, Taiwan
Chih-Ming Huang 22 Hsinchu Hsein, Taiwan
Lung-Yuan Wang 22 Taichung, Taiwan
Chih-Hsien Chiu 22 Taichung City, Taiwan

Chang-Yueh Chan 21 Taichung, Taiwan
Hsin-Yi Liao 21 Taichung, Taiwan
Ho-Yi Tsai 20 Taichung Hsien, Taiwan
Ying-Chou Tsai 20 Taichung, Taiwan

Chee-Key Chung 20 Taichung, Taiwan
Chi-Hsin Chiu 20 Taichung, Taiwan
Yu-Po Wang 20 Taichung, Taiwan
Ho-Chuan Lin 19 Taichung, Taiwan

Hsin-Lung Chung 19 Taichung, Taiwan
Lu-Yi Chen 19 Taichung, Taiwan
Wen-Tsung Tseng 19 Taichung, Taiwan
Ming-Chen Sun 19 Taichung, Taiwan

Chun- Hsien Lin 18 Taichung, Taiwan
Yan-Heng Chen 18 Taichung, Taiwan
Tsung-Hsien Tsai 18 Taichung, Taiwan
Chiang-Cheng Chang 18 Taichung, Taiwan

Yi-Che Lai 18 Taichung, Taiwan
Kuo-Hua Yu 18 Taichung, Taiwan
Wei-Chung Hsiao 17 Taichung, Taiwan
Don-Son Jiang 17 Taichung, Taiwan

Shih-Chao Chiu 16 Taichung, Taiwan
Min-Han Chuang 16 Taichung, Taiwan
Chang-Lun Lu 16 Taichung, Taiwan
Yu-Lung Huang 16 Taichung, Taiwan

Hsi-Chang Hsu 16 Taichung, Taiwan
Chin-Tsai Yao 16 Taichung, Taiwan
Han-Ping PU 16 Taichung, Taiwan
Chia-Chu Lai 16 Taichung City, Taiwan

Chien-Cheng Lin 15 Taichung, Taiwan
Chin-Huang Chang 15 Taichung Hsien, Taiwan
Yuan-Hung Hsu 15 Taichung, Taiwan
Pang-Chun Lin 15 Taichung, Taiwan

Chia-Cheng Chen 15 Taichung, Taiwan
Ming-Fan Tsai 14 Taichung, Taiwan
Fang-Lin Tsai 14 Taichung, Taiwan
Ho-Yi Tsai 14 Taichung, Taiwan

Shao-Tzu Tang 14 Taichung, Taiwan
Chun-Hung Lu 14 Taichung, Taiwan
Fu-Di Tang 14 Taichung, Taiwan
Jung-Pang Huang 13 Taichung, Taiwan

Tzu-Chieh Shen 13 Taichung, Taiwan
Hong-Da Chang 13 Taichung, Taiwan
Yih-Jenn Jiang 13 Taichung, Taiwan
Meng-Tsung Lee 13 Taichung, Taiwan

Kuo-Hua Yu 13 Taichung City, Taiwan
Hsien-Wen Chen 13 Taichung, Taiwan
Chieh-Yuan Chi 13 Taichung, Taiwan
Chun-Yuan Li 12 Taichung, Taiwan

Heng-Cheng Chu 12 Taichung, Taiwan
Shih-Ching Chen 12 Taichung, Taiwan
Ching-Wen Chiang 12 Taichung, Taiwan
Ko-Wei Chang 12 Taichung, Taiwan

Chun-Chi Ke 12 Taichung Hsien, Taiwan
Mao-Hua Yeh 12 Taichung, Taiwan
Wen-Jung Tsai 11 Taichung City, Taiwan
Hsin-Hung Lee 11 Taichung, Taiwan

Chia-Yang Chen 11 Taichung City, Taiwan
Liang-Yi Hung 11 Taichung, Taiwan
Chun-Tang Lin 11 Taichung Hsien, Taiwan
Yi-Min Fu 11 Taichung, Taiwan

Yu-Po Wang 11 Taichung Hsien, Taiwan
Ho-Chuan Lin 10 Taichung City, Taiwan
Cheng-Chia Chiang 10 Taichung, Taiwan
Wei-Ping Wang 10 Taichung, Taiwan

Yi-Che Lai 10 Taichung Hsien, Taiwan
Chien-Ping Huang 10 Hsinchu Hsien, Taiwan
Chin-Huang Chang 9 Taichung, Taiwan
Hung-Wen Liu 9 Taichung, Taiwan

Mu-Hsuan Chan 9 Taichung, Taiwan
Chieh-Lung Lai 9 Taichung, Taiwan
Cheng-Kai Chang 9 Taichung, Taiwan
Yuan-Hung Hsu 9 Taichung City, Taiwan

Min-Han Chuang 9 Taichung City, Taiwan
Don-Son Jiang 9 Taichung City, Taiwan
Feng Kao 9 Taichung, Taiwan
Chi-Ching Ho 9 Taichung City, Taiwan

Chee-Key Chung 9 Taichung City, Taiwan
Chao-Ya Yang 9 Taichung, Taiwan
Yueh-Ying Tsai 9 Taichung, Taiwan
Bo-Siang Fang 8 Taichung, Taiwan

Recent patent applications by Siliconware Precision Industries Co., Ltd.

Siliconware Precision Industries Co., Ltd. based in Taichung, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-02-12

US20260047498A1

Electricity

ELECTRONIC PACKAGE

#2 | 2025-10-02

US20250309060A1

Electricity

ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME

#3 | 2025-02-06

US20250046771A1

Electricity

METHOD FOR FABRICATING ELECTRONIC PACKAGE

#4 | 2025-01-09

US20250015054A1

Electricity

CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRATE, AND METHODS FOR MANUFACTURING THE SAME

#5 | 2024-12-05 ✅ Patent 12,526,912 granted on 2026-01-13

US20240407079A1

Electricity

CARRIER STRUCTURE

#6 | 2024-11-14

US20240379534A1

Electricity

ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRONIC STRUCTURE

#7 | 2024-10-31 ✅ Patent 12,438,266 granted on 2025-10-07

US20240364001A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ANTENNA MODULE AND MANUFACTURING METHOD THEREOF

#8 | 2024-10-03 ✅ Patent 12,469,774 granted on 2025-11-11

US20240332149A1

Electricity

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

#9 | 2024-09-26 ✅ Patent 12,255,165 granted on 2025-03-18

US20240321798A1

Electricity

Electronic package and carrier thereof and method for manufacturing the same

#10 | 2024-09-26 ✅ Patent 12,224,255 granted on 2025-02-11

US20240321784A1

Electricity

Electronic package including lead frame having multiple conductive posts

#11 | 2024-09-26 ✅ Patent 12,394,636 granted on 2025-08-19

US20240321591A1

Electricity

METHOD FOR FABRICATING ELECTRONIC PACKAGE

#12 | 2024-08-29 ✅ Patent 12,532,745 granted on 2026-01-20

US20240290728A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#13 | 2024-08-29 ✅ Patent 12,412,820 granted on 2025-09-09

US20240290701A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#14 | 2024-08-29 ✅ Patent 12,500,145 granted on 2025-12-16

US20240290691A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#15 | 2024-08-29 ✅ Patent 12,293,952 granted on 2025-05-06

US20240290675A1

Electricity

Electronic package and manufacturing method thereof

#16 | 2024-08-29 ✅ Patent 12,368,081 granted on 2025-07-22

US20240290674A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#17 | 2024-08-22 ✅ Patent 12,362,263 granted on 2025-07-15

US20240282674A1

Electricity

ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME

#18 | 2024-08-15 ✅ Patent 12,412,819 granted on 2025-09-09

US20240274519A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#19 | 2024-08-01 ✅ Patent 12,354,885 granted on 2025-07-08

US20240258121A1

Electricity

ELECTRONIC PACKAGE, ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF

#20 | 2024-07-11

US20240234272A9

Electricity

ELECTRONIC PACKAGE

#21 | 2024-07-04 ✅ Patent 12,451,416 granted on 2025-10-21

US20240222250A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#22 | 2024-06-27

US20240213134A1

Electricity

ELECTRONIC PACKAGE

#23 | 2024-06-20

US20240203900A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#24 | 2024-05-23

US20240170415A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#25 | 2024-05-23 ✅ Patent 12,500,131 granted on 2025-12-16

US20240170355A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#26 | 2024-05-16 ✅ Patent 12,283,560 granted on 2025-04-22

US20240162180A1

Electricity

Electronic package including electronic structure and electronic body and manufacturing method thereof

#27 | 2024-05-16 ✅ Patent 12,205,906 granted on 2025-01-21

US20240162169A1

Electricity

Electronic package and fabrication method thereof

#28 | 2024-05-16 ✅ Patent 12,438,079 granted on 2025-10-07

US20240162140A1

Electricity

ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRONIC STRUCTURE

#29 | 2024-05-16

US20240162101A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#30 | 2024-05-09 ✅ Patent 12,575,420 granted on 2026-03-10

US20240153884A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#31 | 2024-05-02 ✅ Patent 12,646,826 granted on 2026-06-02

US20240145908A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#32 | 2024-05-02 ✅ Patent 12,616,067 granted on 2026-04-28

US20240145455A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#33 | 2024-05-02 ✅ Patent 12,500,181 granted on 2025-12-16

US20240145403A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#34 | 2024-05-02 ✅ Patent 12,616,034 granted on 2026-04-28

US20240145398A1

Electricity

CARRIER STRUCTURE

#35 | 2024-05-02 ✅ Patent 12,154,848 granted on 2024-11-26

US20240145372A1

Electricity

Electronic package and manufacturing method thereof, and substrate structure

#36 | 2024-04-25

US20240136263A1

Electricity

ELECTRONIC PACKAGE

#37 | 2024-04-18 ✅ Patent 12,476,229 granted on 2025-11-18

US20240128249A1

Electricity

ELECTRONIC PACKAGE

#38 | 2024-03-21

US20240096835A1

Electricity

MANUFACTURING METHOD OF ELECTRONIC PACKAGE

#39 | 2024-03-14 ✅ Patent 12,417,983 granted on 2025-09-16

US20240088054A1

Electricity

CARRIER STRUCTURE

#40 | 2024-03-07 ✅ Patent 12,334,425 granted on 2025-06-17

US20240079301A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#41 | 2024-02-29 ✅ Patent 12,494,460 granted on 2025-12-09

US20240072019A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#42 | 2024-02-15

US20240055402A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#43 | 2024-02-08 ✅ Patent 12,219,693 granted on 2025-02-04

US20240049382A1

Electricity

Carrier structure

#44 | 2024-02-08 ✅ Patent 12,388,062 granted on 2025-08-12

US20240047440A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#45 | 2024-02-08 ✅ Patent 12,412,869 granted on 2025-09-09

US20240047420A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF

#46 | 2024-02-08 ✅ Patent 12,525,524 granted on 2026-01-13

US20240047336A1

Electricity

ELECTRONIC PACKAGE

#47 | 2024-02-01 ✅ Patent 12,334,452 granted on 2025-06-17

US20240038685A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#48 | 2024-02-01 ✅ Patent 12,278,189 granted on 2025-04-15

US20240038670A1

Electricity

Electronic package and manufacturing method thereof

#49 | 2023-12-28 ✅ Patent 12,125,828 granted on 2024-10-22

US20230420420A1

Electricity

Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same

#50 | 2023-12-28 ✅ Patent 12,368,116 granted on 2025-07-22

US20230420391A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#51 | 2023-12-21

US20230411364A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#52 | 2023-12-14 ✅ Patent 12,334,456 granted on 2025-06-17

US20230402409A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#53 | 2023-12-07 ✅ Patent 12,255,182 granted on 2025-03-18

US20230395571A1

Electricity

Electronic package and manufacturing method thereof

#54 | 2023-11-30 ✅ Patent 12,100,648 granted on 2024-09-24

US20230386992A1

Electricity

Electronic module, manufacturing method thereof and electronic package having the same

#55 | 2023-11-30 ✅ Patent 12,528,220 granted on 2026-01-20

US20230381996A1

Performing operations; transporting

ULTRASONIC DEVICE

#56 | 2023-11-16 ✅ Patent 12,532,766 granted on 2026-01-20

US20230369268A1

Electricity

ELECTRONIC PACKAGE AND ELECTRONIC STRUCTURE THEREOF

#57 | 2023-11-09 ✅ Patent 12,100,641 granted on 2024-09-24

US20230360997A1

Electricity

Electronic package and method for manufacturing the same

#58 | 2023-10-26 ✅ Patent 12,278,173 granted on 2025-04-15

US20230343692A1

Electricity

Electronic package and substrate structure thereof

#59 | 2023-10-26 ✅ Patent 12,308,308 granted on 2025-05-20

US20230343691A1

Electricity

Electronic package

#60 | 2023-10-26 ✅ Patent 12,014,967 granted on 2024-06-18

US20230343665A1

Electricity

Manufacturing method of electronic package comprising a wire within an electronic component

#61 | 2023-10-26 ✅ Patent 12,068,211 granted on 2024-08-20

US20230343664A1

Electricity

Electronic package comprising multiple wires inside an electronic component

#62 | 2023-10-26 ✅ Patent 12,100,633 granted on 2024-09-24

US20230343663A1

Electricity

Electronic package comprising wire inside an electronic component

#63 | 2023-10-26 ✅ Patent 12,033,868 granted on 2024-07-09

US20230343603A1

Electricity

Electronic package and method for fabricating the same

#64 | 2023-09-28 ✅ Patent 12,159,821 granted on 2024-12-03

US20230307339A1

Electricity

Electronic package and manufacturing method thereof

#65 | 2023-09-07 ✅ Patent 12,068,535 granted on 2024-08-20

US20230282972A1

Electricity

Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof

#66 | 2023-09-07 ✅ Patent 12,176,291 granted on 2024-12-24

US20230282586A1

Electricity

Electronic package and manufacturing method thereof

#67 | 2023-08-31 ✅ Patent 12,057,618 granted on 2024-08-06

US20230275337A1

Electricity

Electronic package and fabrication method thereof

#68 | 2023-08-24 ✅ Patent 12,176,327 granted on 2024-12-24

US20230268328A1

Electricity

Method for fabricating electronic package

#69 | 2023-08-24 ✅ Patent 12,500,159 granted on 2025-12-16

US20230268262A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#70 | 2023-08-10 ✅ Patent 12,438,094 granted on 2025-10-07

US20230253331A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#71 | 2023-08-03 ✅ Patent 11,973,043 granted on 2024-04-30

US20230245986A1

Electricity

Multiple conductive posts

#72 | 2023-07-20 ✅ Patent 12,628,673 granted on 2026-05-12

US20230230912A1

Electricity

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

#73 | 2023-07-13 ✅ Patent 12,211,776 granted on 2025-01-28

US20230223322A1

Electricity

Electronic package and manufacturing method thereof

#74 | 2023-07-13 ✅ Patent 12,387,993 granted on 2025-08-12

US20230223316A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#75 | 2023-06-22 ✅ Patent 12,113,004 granted on 2024-10-08

US20230197591A1

Electricity

Electronic package and manufacturing method thereof

#76 | 2023-06-15 ✅ Patent 12,107,055 granted on 2024-10-01

US20230187382A1

Electricity

Electronic package and fabrication method thereof

#77 | 2023-05-25 ✅ Patent 12,057,409 granted on 2024-08-06

US20230163082A1

Electricity

Electronic package and manufacturing method thereof

#78 | 2023-05-18 ✅ Patent 11,984,412 granted on 2024-05-14

US20230154873A1

Electricity

Electronic package and manufacturing method thereof

#79 | 2023-05-18 ✅ Patent 12,230,590 granted on 2025-02-18

US20230154872A1

Electricity

Electronic package and manufacturing method thereof

#80 | 2023-05-18 ✅ Patent 12,199,047 granted on 2025-01-14

US20230154865A1

Electricity

Electronic package and manufacturing method thereof

#81 | 2023-05-04 ✅ Patent 12,132,003 granted on 2024-10-29

US20230136541A1

Electricity

Electronic package and manufacturing method thereof

#82 | 2023-04-13 ✅ Patent 12,051,641 granted on 2024-07-30

US20230111192A1

Electricity

Electronic package and manufacturing method thereof

#83 | 2023-03-16

US20230082767A1

Electricity

ELECTRONIC PACKAGE

#84 | 2023-03-09 ✅ Patent 12,046,494 granted on 2024-07-23

US20230076941A1

Electricity

Chip matching system and method thereof

#85 | 2023-03-02 ✅ Patent 12,414,232 granted on 2025-09-09

US20230066456A1

Electricity

SUBSTRATE STRUCTURE

#86 | 2023-02-16 ✅ Patent 11,810,862 granted on 2023-11-07

US20230053125A1

Electricity

Electronic package and manufacturing method thereof

#87 | 2023-01-19 ✅ Patent 12,400,931 granted on 2025-08-26

US20230014476A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#88 | 2022-12-22 ✅ Patent 11,605,554 granted on 2023-03-14

US20220406642A1

Electricity

Flip-chip process and bonding equipment

#89 | 2022-12-15 ✅ Patent 12,525,505 granted on 2026-01-13

US20220399246A1

Electricity

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

#90 | 2022-12-15 ✅ Patent 11,984,379 granted on 2024-05-14

US20220399245A1

Electricity

Electronic package and manufacturing method thereof

#91 | 2022-12-08 ✅ Patent 12,027,484 granted on 2024-07-02

US20220392861A1

Electricity

Electronic package and carrier thereof and method for manufacturing the same

#92 | 2022-11-24 ✅ Patent 11,749,583 granted on 2023-09-05

US20220375822A1

Electricity

Electronic package and method for manufacturing the same

#93 | 2022-11-24 ✅ Patent 12,080,618 granted on 2024-09-03

US20220375813A1

Electricity

Electronic package, heat dissipation structure and manufacturing method thereof

#94 | 2022-11-10 ✅ Patent 12,027,753 granted on 2024-07-02

US20220359975A1

Electricity

Electronic package and antenna structure thereof

#95 | 2022-11-10 ✅ Patent 11,728,234 granted on 2023-08-15

US20220359324A1

Electricity

Electronic package comprising wire inside an electronic component and manufacturing method thereof

#96 | 2022-10-20 ✅ Patent 12,100,642 granted on 2024-09-24

US20220336323A1

Electricity

Electronic package and fabrication method thereof

#97 | 2022-09-22 ✅ Patent 12,114,427 granted on 2024-10-08

US20220304157A1

Electricity

Method for fabricating assemble substrate

#98 | 2022-09-01 ✅ Patent 11,676,877 granted on 2023-06-13

US20220278013A1

Electricity

Electronic package with multiple electronic components spaced apart by grooves

#99 | 2022-08-18 ✅ Patent 11,682,826 granted on 2023-06-20

US20220263221A1

Electricity

Electronic package and fabrication method thereof

#100 | 2022-08-18 ✅ Patent 11,670,607 granted on 2023-06-06

US20220262747A1

Electricity

Electronic package

Also check out Siliconware Precision Industries Co., Ltd.'s (Taichung, Taiwan) applicant profile with 408 patent applications submitted.

AssigneeID:

2889 ⎘