Benjamin A. Samples

City:

Bend, Oregon

Country:

United States

Published Applications:

Last publication date:

2018-12-06

Top Assignees for applications by Benjamin A. Samples

The entities that hold a legal rights for patent applications filed by inventor Samples Benjamin A.:

Benjamin A. Samples from Bend, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Lid cover spring design

Multi-layer thick-film RF package

RF package

InventorID:

2367587 ⎘