Regensburg
Germany
15
2026-01-15
The entities that hold a legal rights for patent applications filed by inventor Fehler Robert:
Robert Fehler from Regensburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Embedded Package with Shielding Pad
#2 | 2025-03-13METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE
#3 | 2024-09-19Embedded Package with Shielding Pad
#4 | 2024-03-07Semiconductor package and passive element with interposer
#5 | 2023-08-10Semiconductor module having a multi-branch switch node connector
#6 | 2022-11-17Semiconductor package with non-uniformly distributed vias
#7 | 2022-08-18Semiconductor package and passive element with interposer
#8 | 2022-04-07Semiconductor module
#9 | 2022-01-27Circuitry and method of forming a circuitry
#10 | 2021-09-16Semiconductor devices including parallel electrically conductive layers
#11 | 2021-07-22Space efficient and low parasitic half bridge
#12 | 2021-01-07Semiconductor package and method of manufacturing a semiconductor package
#13 | 2020-03-05Semiconductor package and method of manufacturing a semiconductor package
#14 | 2019-08-29Semiconductor package and method of manufacturing a semiconductor package
#15 | 2018-12-27Electronic device including redistribution layer pad having a void
2387549 ⎘