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Inventor profile of:

Barbara Eichinger

City:

Villach

Country:

Austria

Published Applications:

5

Last publication date:

2023-03-02

Top Assignees for applications by Barbara Eichinger

The entities that hold a legal rights for patent applications filed by inventor Eichinger Barbara:

  • INFINEON TECHNOLOGIES AG 5 Neubiberg, Germany

Recent patent applications by Eichinger Barbara

Barbara Eichinger from Villach, AT has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-03-02
US20230063259A1
Electricity

High density and durable semiconductor device interconnect

#2 | 2021-06-03
US20210167036A1
Electricity

Semiconductor device including an electrical contact with a metal layer arranged thereon

#3 | 2021-04-01
US20210098410A1
Electricity

Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect

#4 | 2020-05-21
US20200161269A1
Electricity

Method for fabricating a semiconductor device comprising a paste layer and semiconductor device

#5 | 2018-12-27
US20180374843A1
Electricity

Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures

InventorID:

2387604 ⎘

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