Inventor profile of:

Junnosuke TAGUCHI

City:

Iwate

Country:

Japan

Published Applications:

16

Last publication date:

2025-11-20

Top Assignees for applications by Junnosuke TAGUCHI

The entities that hold a legal rights for patent applications filed by inventor TAGUCHI Junnosuke:

Recent patent applications by TAGUCHI Junnosuke

Junnosuke TAGUCHI from Iwate, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-20
US20250354265A1
Chemistry; metallurgy

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

#2 | 2025-02-13
US20250051920A1
Chemistry; metallurgy

SUBSTRATE-PROCESSING APPARATUS AND SUBSTRATE-PROCESSING METHOD

#3 | 2025-02-06
US20250046646A1
Electricity

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE MAP GENERATING METHOD

#4 | 2024-09-05
US20240295027A1
Chemistry; metallurgy

SUBSTRATE PROCESSING APPARATUS

#5 | 2024-02-22
US20240060181A1
Chemistry; metallurgy

SUBSTRATE PROCESSING APPARATUS

#6 | 2023-08-17
US20230257877A1
Chemistry; metallurgy

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

#7 | 2023-03-02
US20230062671A1
Chemistry; metallurgy

SUBSTRATE PROCESSING APPARATUS

#8 | 2023-03-02
US20230061423A1
Electricity

Substrate processing apparatus

#9 | 2022-09-15
US20220293439A1
Electricity

SUBSTRATE PROCESSING APPARATUS

#10 | 2022-04-28
US20220130712A1
Electricity

Substrate processing apparatus

#11 | 2021-07-15
US20210217651A1
Electricity

Substrate processing apparatus

#12 | 2021-07-15
US20210214845A1
Chemistry; metallurgy

SUBSTRATE PROCESSING APPARATUS AND ROTARY DRIVE METHOD

#13 | 2021-06-17
US20210180187A1
Chemistry; metallurgy

Rotational drive device, substrate processing apparatus, and rotational driving method

#14 | 2020-11-19
US20200365594A1
Electricity

Substrate processing apparatus and monitoring method

#15 | 2019-01-10
US20190013225A1
Electricity

Substrate warpage detection device, substrate warpage detection method, and substrate processing apparatus and substrate processing method using the same

#16 | 2019-01-10
US20190013224A1
Electricity

Substrate warping monitoring device and substrate processing apparatus using the same, and substrate warping monitoring method

InventorID:

2399846 ⎘