Scotts Valley, California
United States
19
2017-05-18
The entities that hold a legal rights for patent applications filed by inventor McGrath Scott:
Scott McGrath from Scotts Valley, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Stiffened wires for offset BVA
#2 | 2017-02-09Methods and structures to repair device warpage
#3 | 2017-01-19Flipped die stack
#4 | 2016-04-14Semiconductor die mount by conformal die coating
#5 | 2016-01-28Electrical connector between die pad and z-interconnect for stacked die assemblies
#6 | 2014-07-31Semiconductor die mount by conformal die coating
#7 | 2013-05-16BONDING WEDGE
#8 | 2012-05-17Electrical connector between die pad and z-interconnect for stacked die assemblies
#9 | 2011-11-10Stacked die assembly having reduced stress electrical interconnects
#10 | 2011-06-23Wafer level surface passivation of stackable integrated circuit chips
#11 | 2011-02-17Electrically interconnected stacked die assemblies
#12 | 2010-06-10SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELECTRICALLY CONDUCTIVE MATERIAL
#13 | 2009-04-23CHIP SCALE STACKED DIE PACKAGE
#14 | 2009-03-12Electrical Interconnect Formed by Pulsed Dispense
#15 | 2009-03-12Semiconductor die mount by conformal die coating
#16 | 2008-12-25Wafer level surface passivation of stackable integrated circuit chips
#17 | 2008-12-25THREE-DIMENSIONAL CIRCUITRY FORMED ON INTEGRATED CIRCUIT DEVICE USING TWO-DIMENSIONAL FABRICATION
#18 | 2008-12-11Electrically interconnected stacked die assemblies
#19 | 2008-09-18Vertical electrical interconnect formed on support prior to die mount
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