Munich
Germany
19
2024-05-02
The entities that hold a legal rights for patent applications filed by inventor Seidel Uwe:
Uwe Seidel from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES
#2 | 2023-06-15Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component
#3 | 2022-04-14Methods and devices related to radio frequency devices
#4 | 2021-10-28Electronic component with semiconductor die having a low ohmic portion with an active area and a high ohmic portion on a dielectric layer
#5 | 2021-02-11Methods and devices related to radio frequency devices
#6 | 2019-02-07Device and method for manufacturing the device
#7 | 2015-01-15Semiconductor structure and method for making same
#8 | 2014-05-08Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
#9 | 2013-12-12Shielding device
#10 | 2013-10-10Through substrate via semiconductor components and methods of formation thereof
#11 | 2013-01-31Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
#12 | 2012-10-04Micromechanical sound transducer having a membrane support with tapered surface
#13 | 2011-10-27Shielding device
#14 | 2011-03-31Method for making conductive interconnects
#15 | 2010-11-04Method for producing a copper connection between two sides of a substrate
#16 | 2010-09-16Through substrate via semiconductor components
#17 | 2009-12-10Through substrate via semiconductor components
#18 | 2007-11-15Shielding device
#19 | 2005-07-14Method for fabrication of a contact structure
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