Hsinchu
Taiwan
8
2013-11-07
The entities that hold a legal rights for patent applications filed by inventor Wang David Wei:
David Wei Wang from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Thermally enhanced electronic package
#2 | 2013-05-16THERMALLY ENHANCED PACKAGING STRUCTURE
#3 | 2011-12-22Multi-chip stack package structure
#4 | 2011-12-22Multi-chip stack package structure
#5 | 2011-12-22Multi-chip stack package structure
#6 | 2011-12-15Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same
#7 | 2011-12-01Semiconductor wafer structure and multi-chip stack structure
#8 | 2010-01-14Semiconductor package structure and method for manufacturing the same
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