Hsinchu
Taiwan
196
2019-03-14
168
2019-02-19
These are the the leading inventors for applications assigned to CHIPMOS TECHNOLOGIES INC.:
CHIPMOS TECHNOLOGIES INC. based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Chip-on-film package structure
#2 | 2018-03-01SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#3 | 2018-01-02 ✅ Patent 9,859,239 granted on 2018-01-02Re-distribution layer structure and manufacturing method thereof
#4 | 2017-12-07 ✅ Patent 10,068,861 granted on 2018-09-04Semiconductor device
#5 | 2017-11-16 ✅ Patent 9,865,777 granted on 2018-01-09Semicondcutor light-emitting device and fabricating method thereof
#6 | 2017-10-17 ✅ Patent 9,793,229 granted on 2017-10-17Insulating protrusion in the trench of a re-distribution layer structure
#7 | 2017-10-05 ✅ Patent 10,002,815 granted on 2018-06-19Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process
#8 | 2017-10-03 ✅ Patent 9,780,056 granted on 2017-10-03Solder ball, manufacturing method thereof, and semiconductor device
#9 | 2017-08-15 ✅ Patent 9,735,132 granted on 2017-08-15Semiconductor package
#10 | 2017-08-03 ✅ Patent 9,953,960 granted on 2018-04-24Manufacturing process of wafer level chip package structure having block structure
#11 | 2017-04-11 ✅ Patent 9,620,445 granted on 2017-04-11Chip package structure and method of manufacturing the same
#12 | 2016-12-15 ✅ Patent 9,847,254 granted on 2017-12-19Fingerprint sensor chip package structure and manufacturing method thereof
#13 | 2016-12-08 ✅ Patent 9,721,913 granted on 2017-08-01Semiconductor package and method of manufacturing thereof
#14 | 2016-10-27 ✅ Patent 9,653,429 granted on 2017-05-16Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereof
#15 | 2016-10-27 ✅ Patent 9,728,479 granted on 2017-08-08Multi-chip package structure, wafer level chip package structure and manufacturing process thereof
#16 | 2016-10-06 ✅ Patent 9,735,092 granted on 2017-08-15Manufacturing method of chip package structure
#17 | 2016-04-21 ✅ Patent 9,437,542 granted on 2016-09-06Chip package structure
#18 | 2015-10-22 ✅ Patent 9,318,422 granted on 2016-04-19Flat no-lead package and the manufacturing method thereof
#19 | 2015-10-15 ✅ Patent 9,401,318 granted on 2016-07-26Quad flat no-lead package and manufacturing method thereof
#20 | 2015-10-08 ✅ Patent 9,437,529 granted on 2016-09-06Chip package structure and manufacturing method thereof
#21 | 2015-06-18REDISTRIBUTION LAYER ALLOY STRUCTURE AND MANUFACTURING METHOD THEREOF
#22 | 2015-06-18 ✅ Patent 9,269,643 granted on 2016-02-23Chip package structure
#23 | 2015-06-11 ✅ Patent 9,123,684 granted on 2015-09-01Chip package structure and manufacturing method thereof
#24 | 2015-05-14PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#25 | 2015-05-07LEAD FRAME PACKAGE AND MANUFACTURING METHOD THEREOF
#26 | 2015-03-19CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#27 | 2015-03-05 ✅ Patent 9,087,912 granted on 2015-07-21Method for wafer level packaging and a package structure thereof
#28 | 2015-02-26BALL PLANTING DEVICE AND BALL PLANTING METHOD THEREOF
#29 | 2015-01-08 ✅ Patent 9,159,685 granted on 2015-10-13Conductive structure and method for forming the same
#30 | 2014-11-04 ✅ Patent 8,877,630 granted on 2014-11-04Semiconductor structure having a silver alloy bump body and manufacturing method thereof
#31 | 2014-10-30 ✅ Patent 8,895,368 granted on 2014-11-25Method for manufacturing chip package structure
#32 | 2014-10-23 ✅ Patent 8,980,695 granted on 2015-03-17Manufacturing method of wafer level package
#33 | 2014-07-15 ✅ Patent 8,779,604 granted on 2014-07-15Semiconductor structure and manufacturing method thereof
#34 | 2014-06-12 ✅ Patent 9,018,772 granted on 2015-04-28Chip structure and multi-chip stack package
#35 | 2014-03-06 ✅ Patent 9,190,324 granted on 2015-11-17Manufacturing method for micro bump structure
#36 | 2014-03-06SEMICONDUCTOR STRUCTURE
#37 | 2014-03-06 ✅ Patent 9,576,820 granted on 2017-02-21Semiconductor structure and method of manufacturing the same
#38 | 2014-03-06 ✅ Patent 8,836,144 granted on 2014-09-16Wafer level package structure
#39 | 2014-01-02 ✅ Patent 9,023,727 granted on 2015-05-05Method of manufacturing semiconductor packaging
#40 | 2013-11-07 ✅ Patent 9,307,676 granted on 2016-04-05Thermally enhanced electronic package
#41 | 2013-11-07 ✅ Patent 8,786,109 granted on 2014-07-22Conductive structure and method for forming the same
#42 | 2013-10-24 ✅ Patent 8,962,395 granted on 2015-02-24QFN package and manufacturing process thereof
#43 | 2013-09-26 ✅ Patent 8,809,088 granted on 2014-08-19Structure of stacking chips and method for manufacturing the same
#44 | 2013-09-26 ✅ Patent 9,082,710 granted on 2015-07-14Chip packaging substrate and chip packaging structure
#45 | 2013-07-18 ✅ Patent 9,053,968 granted on 2015-06-09Semiconductor package structure and manufacturing method thereof
#46 | 2013-06-13 ✅ Patent 8,786,082 granted on 2014-07-22Semiconductor structure having no adjacent bumps between two adjacent pads
#47 | 2013-06-06 ✅ Patent 8,691,630 granted on 2014-04-08Semiconductor package structure and manufacturing method thereof
#48 | 2013-05-23 ✅ Patent 8,872,336 granted on 2014-10-28Conductive structure and method for forming the same
#49 | 2013-05-16THERMALLY ENHANCED PACKAGING STRUCTURE
#50 | 2013-03-21 ✅ Patent 8,431,478 granted on 2013-04-30Solder cap bump in semiconductor package and method of manufacturing the same
#51 | 2013-03-14 ✅ Patent 8,426,255 granted on 2013-04-23Chip package structure and method for manufacturing the same
#52 | 2013-02-28SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#53 | 2013-02-28 ✅ Patent 9,196,553 granted on 2015-11-24Semiconductor package structure and manufacturing method thereof
#54 | 2013-02-07CHIP PACKAGE STRUCTURE
#55 | 2013-02-07 ✅ Patent 8,723,316 granted on 2014-05-13Chip package structure using flexible substrate
#56 | 2013-01-24 ✅ Patent 8,772,089 granted on 2014-07-08Chip package structure and manufacturing method thereof
#57 | 2012-11-29THERMALLY ENHANCED LIGHT EMITTING DEVICE PACKAGE
#58 | 2012-11-01 ✅ Patent 8,712,932 granted on 2014-04-29Computer implemented apparatus for generating and filtering creative proposal
#59 | 2012-09-27PACKAGE-ON-PACKAGE STRUCTURE
#60 | 2012-06-21 ✅ Patent 8,697,566 granted on 2014-04-15Bump structure and manufacturing method thereof
#61 | 2012-06-21 ✅ Patent 8,309,401 granted on 2012-11-13Method of manufacturing non-leaded package structure
#62 | 2012-04-19 ✅ Patent 8,652,882 granted on 2014-02-18Chip package structure and chip packaging method
#63 | 2012-03-29 ✅ Patent 8,736,060 granted on 2014-05-27Packaging structure
#64 | 2011-12-22 ✅ Patent 8,264,068 granted on 2012-09-11Multi-chip stack package structure
#65 | 2011-12-22 ✅ Patent 8,269,352 granted on 2012-09-18Multi-chip stack package structure
#66 | 2011-12-22 ✅ Patent 8,269,351 granted on 2012-09-18Multi-chip stack package structure
#67 | 2011-12-15 ✅ Patent 8,564,954 granted on 2013-10-22Thermally enhanced electronic package
#68 | 2011-12-15 ✅ Patent 8,338,935 granted on 2012-12-25Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same
#69 | 2011-12-08Semiconductor Structure
#70 | 2011-12-01 ✅ Patent 8,274,150 granted on 2012-09-25Chip bump structure and method for forming the same
#71 | 2011-11-17 ✅ Patent 8,338,938 granted on 2012-12-25Chip package device and manufacturing method thereof
#72 | 2011-11-17 ✅ Patent 8,430,124 granted on 2013-04-30Ventilating apparatus
#73 | 2011-11-17 ✅ Patent 8,443,836 granted on 2013-05-21Ventilating apparatus
#74 | 2011-09-01 ✅ Patent 8,211,789 granted on 2012-07-03Manufacturing method of a bump structure having a reinforcement member
#75 | 2011-08-25 ✅ Patent 8,058,109 granted on 2011-11-15Method for manufacturing a semiconductor structure
#76 | 2011-07-28 ✅ Patent 8,426,245 granted on 2013-04-23Packaging method involving rearrangement of dice
#77 | 2011-07-28 ✅ Patent 8,431,437 granted on 2013-04-30Packaging method involving rearrangement of dice
#78 | 2011-06-30 ✅ Patent 8,148,827 granted on 2012-04-03Quad flat no lead (QFN) package
#79 | 2011-06-16 ✅ Patent 8,071,471 granted on 2011-12-06Packaging conductive structure and method for manufacturing the same
#80 | 2011-06-09 ✅ Patent 8,105,876 granted on 2012-01-31Leadframe for leadless package, structure and manufacturing method using the same
#81 | 2011-06-09 ✅ Patent 8,106,494 granted on 2012-01-31Leadframe for leadless package, structure and manufacturing method using the same
#82 | 2011-03-24 ✅ Patent 8,093,106 granted on 2012-01-10Method for manufacturing packaging structure
#83 | 2010-12-16 ✅ Patent 8,207,603 granted on 2012-06-26Stacked chip package structure with leadframe having inner leads with transfer pad
#84 | 2010-10-21 ✅ Patent 8,026,615 granted on 2011-09-27IC package reducing wiring layers on substrate and its carrier
#85 | 2010-10-21 ✅ Patent 8,169,061 granted on 2012-05-01Stacked chip package structure with leadframe having bus bar
#86 | 2010-10-21 ✅ Patent 8,212,347 granted on 2012-07-03Stacked chip package structure with leadframe having bus bar
#87 | 2010-09-30 ✅ Patent 8,237,249 granted on 2012-08-07Stacked multichip package
#88 | 2010-08-19 ✅ Patent 8,253,235 granted on 2012-08-28Semiconductor packaging substrate improving capability of electrostatic dissipation
#89 | 2010-08-12 ✅ Patent 7,952,198 granted on 2011-05-31BGA package with leads on chip
#90 | 2010-07-29 ✅ Patent 7,919,874 granted on 2011-04-05Chip package without core and stacked chip package structure
#91 | 2010-07-29CHIP PACKAGE WITHOUT CORE AND STACKED CHIP PACKAGE STRUCTURE
#92 | 2010-07-15 ✅ Patent 7,879,653 granted on 2011-02-01Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#93 | 2010-06-24 ✅ Patent 7,888,783 granted on 2011-02-15Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers
#94 | 2010-06-17 ✅ Patent 7,981,725 granted on 2011-07-19Fabricating process of a chip package structure
#95 | 2010-05-27 ✅ Patent 7,843,054 granted on 2010-11-30Chip package and manufacturing method thereof
#96 | 2010-05-20MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#97 | 2010-05-13 ✅ Patent 7,842,550 granted on 2010-11-30Method of fabricating quad flat non-leaded package
#98 | 2010-04-08 ✅ Patent 7,915,690 granted on 2011-03-29Die rearrangement package structure using layout process to form a compliant configuration
#99 | 2010-01-21 ✅ Patent 7,879,651 granted on 2011-02-01Packaging conductive structure and method for forming the same
#100 | 2010-01-14 ✅ Patent 7,973,310 granted on 2011-07-05Semiconductor package structure and method for manufacturing the same
Also check out ChipMOS Technologies Inc.'s (Hsinchu, Taiwan) applicant profile with 40 patent applications submitted.
5532 ⎘