Klamath Falls, Oregon
United States
239
2026-05-07
The entities that hold a legal rights for patent applications filed by inventor Cronquist Brian:
Brian Cronquist from Klamath Falls, US has applied for patents for these inventions. The list has both pending applications and granted patents:
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH LOGIC CIRCUITS, MEMORY CELLS, AND PROCESSOR ARRAY
#2 | 2026-03-12METHODS TO PROCESS 3D SEMICONDUCTOR DEVICES AND STRUCTURES WHICH HAVE METAL LAYERS
#3 | 2026-02-05METHODS OF FABRICATING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS AND MEMORY CELLS
#4 | 2026-01-22THROUGHPUT IMPROVEMENTS FOR LOW-TEMPERATURE/BEOL-COMPATIBLE HIGHLY SCALABLE GRAPHENE SYNTHESIS METHODS INCLUDING PROCESSING IN RETASKED TOOLS
#5 | 2026-01-01METHODS OF MANUFACTURING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH ELECTRONIC CIRCUIT UNITS
#6 | 2025-12-113D SEMICONDUCTOR DEVICE AND STRUCTURE INCLUDING POWER DISTRIBUTION GRIDS
#7 | 2025-12-113D SEMICONDUCTOR DEVICE AND STRUCTURE WITH CONNECTION PATHS
#8 | 2025-11-27METHODS OF FORMING TRANSISTOR INTERCONNECTS ON TOP OF A SEMICONDUCTOR DEVICE SUBSTRATE
#9 | 2025-11-27METHODS OF FORMING TRANSISTOR INTERCONNECTS ON TOP OF A SEMICONDUCTOR DEVICE SUBSTRATE
#10 | 2025-11-27METHODS OF FORMING TRANSISTOR INTERCONNECTS ON TOP OF A SEMICONDUCTOR DEVICE SUBSTRATE
#11 | 2025-11-20METHODS FOR FABRICATING 3D MEMORY DEVICES AND STRUCTURES WITH MEMORY ARRAYS AND METAL LAYERS
#12 | 2025-11-203D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
#13 | 2025-11-13METHODS FOR FABRICATING A MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH IMAGE SENSORS AND WAFER BONDING
#14 | 2025-10-30EFFICIENT ELECTRICAL PASSENGER CAR WITH MOTOR CONTROL
#15 | 2025-10-093D SEMICONDUCTOR DEVICE, STRUCTURE AND METHODS WITH MEMORY ARRAYS AND CONNECTIVITY STRUCTURES
#16 | 2025-10-093D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
#17 | 2025-10-02MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH OXIDE BONDING
#18 | 2025-10-023D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE WITH MEMORY CONTROL CIRCUITS
#19 | 2025-09-18LARGE-AREA/WAFER-SCALE CMOS-COMPATIBLE 2D-MATERIAL INTERCALATION DOPING TOOLS, PROCESSES, AND METHODS, INCLUDING INTERCALATION DOPING OF SYNTHESIZED AND PATTERNED GRAPHENE
#20 | 2025-09-09Throughput improvements for low-temperature/beol-compatible highly scalable graphene synthesis methods including processing in retasked tools
#21 | 2025-08-21EFFICIENT ELECTRICAL PASSENGER CAR WITH MOTOR CONTROL
#22 | 2025-08-19Efficient electrical passenger car with motor control
#23 | 2025-07-22Throughput improvements for low-temperature/beol-compatible highly scalable graphene synthesis methods including processing in retasked tools
#24 | 2025-07-10TECHNIQUES, METHODS, AND STRUCTURES FOR RAPID AND EFFICIENT INTERCALATION-DOPING OF LARGE-AREA MULTI- LAYERED GRAPHENE SHEETS FOR TRANSPARENT CONDUCTOR APPLICATIONS, INCLUDING SOLAR CELLS AND DISPLAYS
#25 | 2025-07-10TECHNIQUES, METHODS, AND STRUCTURES FOR RAPID AND EFFICIENT INTERCALATION-DOPING OF LARGE-AREA MULTI- LAYERED GRAPHENE SHEETS FOR TRANSPARENT CONDUCTOR APPLICATIONS, INCLUDING SOLAR CELLS AND DISPLAYS
#26 | 2025-05-013D SEMICONDUCTOR DEVICE AND STRUCTURE INCLUDING POWER DISTRIBUTION GRIDS
#27 | 2025-04-243D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY CELLS
#28 | 2025-03-203D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
#29 | 2025-03-203D MEMORY DEVICES AND STRUCTURES WITH MEMORY ARRAYS AND METAL LAYERS
#30 | 2025-02-273D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
#31 | 2025-01-303D SEMICONDUCTOR DEVICE, STRUCTURE AND METHODS WITH MEMORY ARRAYS AND CONNECTIVITY STRUCTURES
#32 | 2025-01-023D semiconductor device and structure with metal layers and memory cells
#33 | 2024-12-263D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
#34 | 2024-12-053D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPLE METAL LAYERS
#35 | 2024-11-28METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
#36 | 2024-11-213D SEMICONDUCTOR DEVICE AND STRUCTURE WITH LOGIC CIRCUITS, MEMORY CELLS, AND PROCESSOR ARRAY
#37 | 2024-11-143D SEMICONDUCTOR DEVICE AND STRUCTURE WITH CONNECTION PATHS
#38 | 2024-11-143D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
#39 | 2024-11-143D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATION LAYERS
#40 | 2024-11-07MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH IMAGE SENSORS AND WAFER BONDING
#41 | 2024-10-313D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY CELLS
#42 | 2024-10-10Graphene BEOL integration interconnection structures
#43 | 2024-09-263D memory devices and structures with memory arrays and metal layers
#44 | 2024-09-263D semiconductor device and structure with metal layers
#45 | 2024-09-26Efficient electrical passenger car with motor control
#46 | 2024-09-193D semiconductor device and structure with bonding and memory cells preliminary class
#47 | 2024-09-123D semiconductor devices and structures with metal layers
#48 | 2024-09-053D SEMICONDUCTOR DEVICES AND STRUCTURES WITH ELECTRONIC CIRCUIT UNITS
#49 | 2024-09-05MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH OXIDE BONDING
#50 | 2024-08-153D semiconductor device and structure with metal layers
#51 | 2024-08-01Efficient electrical passenger car with motor control
#52 | 2024-07-043D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
#53 | 2024-07-043D semiconductor device and structure with metal layers
#54 | 2024-06-273D semiconductor device and structure with bonding and DRAM memory cells
#55 | 2024-06-203D memory devices and structures with memory arrays and metal layers
#56 | 2024-05-30Multilevel semiconductor device and structure with image sensors and wafer bonding
#57 | 2024-05-30Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
#58 | 2024-05-233D semiconductor memory device and structure with memory and metal layers
#59 | 2024-05-02Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
#60 | 2024-05-02Efficient electrical passenger car with motor control
#61 | 2024-04-183D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
#62 | 2024-04-183D semiconductor device and structure with metal layers and a connective path
#63 | 2024-04-183D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
#64 | 2024-04-113D semiconductor device, structure and methods with connectivity structures
#65 | 2024-04-113D semiconductor devices and structures with metal layers
#66 | 2024-04-113D semiconductor device, structure and methods with connectivity structures
#67 | 2024-04-043D semiconductor device and structure with single-crystal layers
#68 | 2024-03-283D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
#69 | 2024-03-213D semiconductor devices and structures with electronic circuit units
#70 | 2024-03-143D MEMORY DEVICES AND STRUCTURES WITH METAL LAYERS
#71 | 2024-03-073D semiconductor device and structure with metal layers
#72 | 2024-03-07Multilevel semiconductor device and structure with oxide bonding
#73 | 2024-02-153D semiconductor device and structure with bonding
#74 | 2024-02-08Multilevel semiconductor device and structure with image sensors and wafer bonding
#75 | 2023-12-28Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
#76 | 2023-12-213D SEMICONDUCTOR DEVICES AND STRUCTURES WITH ELECTRONIC CIRCUIT UNITS
#77 | 2023-12-143D memory devices and structures with control circuits
#78 | 2023-12-073D semiconductor device and structure with metal layers
#79 | 2023-12-073D semiconductor device and structure with metal layers
#80 | 2023-11-303D semiconductor device and structure including power distribution grids
#81 | 2023-11-303D semiconductor device and structure with bonding
#82 | 2023-11-023D SEMICONDUCTOR DEVICES AND STRUCTURES WITH AT LEAST TWO SINGLE-CRYSTAL LAYERS
#83 | 2023-10-263D semiconductor device and structure with metal layers and a connective path
#84 | 2023-10-263D semiconductor device and structure with single-crystal layers
#85 | 2023-10-193D semiconductor device and structure with metal layers
#86 | 2023-10-123D DRAM memory devices and structures with control circuits
#87 | 2023-10-123D semiconductor devices and structures with electronic circuit units
#88 | 2023-10-05Efficient electrical passenger car with motor control
#89 | 2023-09-28Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
#90 | 2023-08-31Multilevel semiconductor device and structure with image sensors and wafer bonding
#91 | 2023-08-243D semiconductor device and structure with metal layers
#92 | 2023-08-173D semiconductor device and structure including power distribution grids
#93 | 2023-08-10Multilevel semiconductor device and structure with oxide bonding
#94 | 2023-08-103D semiconductor device and structure with metal layers and a connective path
#95 | 2023-06-293D semiconductor device and structure
#96 | 2023-06-223D semiconductor device and structure with metal layers and a connective path
#97 | 2023-06-153D memory devices and structures with control circuits
#98 | 2023-06-15Multilevel semiconductor device and structure with image sensors and wafer bonding
#99 | 2023-06-153D semiconductor device and structure with metal layers
#100 | 2023-06-153D semiconductor device and structure with logic circuits and memory cells
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