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Inventor profile of:

Mukul RENAVIKAR

City:

Chandler, Arizona

Country:

United States

Published Applications:

7

Last publication date:

2019-02-21

Top Assignees for applications by Mukul RENAVIKAR

The entities that hold a legal rights for patent applications filed by inventor RENAVIKAR Mukul:

  • INTEL CORPORATION 6 Santa Clara, CA United States
  • INTEL, INC. 1 Santa Clara, CA United States

Recent patent applications by RENAVIKAR Mukul

Mukul RENAVIKAR from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-02-21
US20190057936A1
Electricity

TRANSMISSIVE COMPOSITE FILM FOR APPLICATION TO THE BACKSIDE OF A MICROELECTRONIC DEVICE

#2 | 2011-12-22
US20110312131A1
Electricity

Forming a semiconductor package including a thermal interface material

#3 | 2011-03-03
US20110051376A1
Electricity

Solder joint reliability in microelectronic packaging

#4 | 2010-02-25
US20100044848A1
Electricity

Solder joint reliability in microelectronic packaging

#5 | 2009-01-01
US20090001557A1
Electricity

Forming a semiconductor package including a thermal interface material

#6 | 2008-05-22
US20080115968A1
Electricity

Solder joint reliability in microelectronic packaging

#7 | 2007-06-14
US20070131737A1
Electricity

Solder deposition and thermal processing of thin-die thermal interface material

InventorID:

2436357 ⎘

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