Folsom, California
United States
19
2024-05-23
The entities that hold a legal rights for patent applications filed by inventor Xu Yi:
Yi Xu from Folsom, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Choked flow cooling
#2 | 2022-06-09Through-substrate void filling for an integrated circuit assembly
#3 | 2020-10-29Die over mold stacked semiconductor package
#4 | 2020-10-01INTERPOSER WITH STEP FEATURE
#5 | 2020-07-23Temporary interconnect for use in testing a semiconductor package
#6 | 2020-07-02Diode for use in testing semiconductor packages
#7 | 2020-06-18Shrinkable package assembly
#8 | 2020-05-14Interposer for electrically connecting stacked integrated circuit device packages
#9 | 2020-04-30Choked flow cooling
#10 | 2020-04-30Solder mask design for delamination prevention
#11 | 2020-04-16PRE-PATTERNED FINE-PITCH BOND PAD INTERPOSER
#12 | 2020-04-16Dual head capillary design for vertical wire bond
#13 | 2020-04-16Pad design for thermal fatigue resistance and interconnect joint reliability
#14 | 2020-04-16Bowl shaped pad
#15 | 2020-04-16DIE WITH BUMPER FOR SOLDER JOINT RELIABILITY
#16 | 2020-04-16Semiconductor package design for solder joint reliability
#17 | 2019-09-05Semiconductor package having singular wire bond on bonding pads
#18 | 2019-04-043D package having edge-aligned die stack with direct inter-die wire connections
#19 | 2019-02-28Semiconductor package with thermal fins
2444044 ⎘