Fei SU

City:

Folsom, California

Country:

United States

Published Applications:

Last publication date:

2019-03-28

Top Assignees for applications by Fei SU

The entities that hold a legal rights for patent applications filed by inventor SU Fei:

Fei SU from Folsom, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Test architecture for die to die interconnect for three dimensional integrated circuits

InventorID:

2467743 ⎘