Chandler, Arizona
United States
19
2013-05-16
The entities that hold a legal rights for patent applications filed by inventor Natekar Devendra:
Devendra Natekar from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Flexible interconnect pattern on semiconductor package
#2 | 2012-11-15Flexible interconnect pattern on semiconductor package
#3 | 2011-05-05Flexible interconnect pattern on semiconductor package
#4 | 2010-08-05Integrated circuit die containing particale-filled through-silicon metal vias with reduced thermal expansion
#5 | 2009-03-19NANO-SCALE PARTICLE PASTE FOR WIRING MICROELECTRONIC DEVICES USING INK-JET PRINTING
#6 | 2008-12-11Thin silicon based substrate
#7 | 2008-10-30Etched interposer for integrated circuit devices
#8 | 2008-10-16Method of forming through-silicon vias with stress buffer collars and resulting devices
#9 | 2007-10-04Flexible interconnect pattern on semiconductor package
#10 | 2007-07-05Horizontal Carbon Nanotubes by Vertical Growth and Rolling
#11 | 2007-04-26Stacked die package with thermally conductive block embedded in substrate
#12 | 2007-01-04Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion
#13 | 2007-01-04Apparatus and method to operate on one or more attach sites in die package assembly
#14 | 2006-12-28Method of forming through-silicon vias with stress buffer collars and resulting devices
#15 | 2006-11-09Methods and devices for supporting substrates using fluids
#16 | 2006-08-24Thin silicon based substrate
#17 | 2006-04-13Method of manufacturing of thin based substrate
#18 | 2006-03-02Thinning semiconductor wafers
#19 | 2006-02-23Etched interposer for integrated circuit devices
248060 ⎘