Daniel Kai Simon

City:

Dresden

Country:

Germany

Published Applications:

Last publication date:

2022-02-17

Top Assignees for applications by Daniel Kai Simon

The entities that hold a legal rights for patent applications filed by inventor Simon Daniel Kai:

Daniel Kai Simon from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Apparatus and method of forming a semiconductor layer

Apparatus and method of depositing a layer at atmospheric pressure

Apparatus and Method of Forming a Semiconductor Layer

Semiconductor device with buffer region

InventorID:

2504555 ⎘