Kon Hoe Chin

City:

Pusing

Country:

Malaysia

Published Applications:

Last publication date:

2024-06-27

Top Assignees for applications by Kon Hoe Chin

The entities that hold a legal rights for patent applications filed by inventor Chin Kon Hoe:

Kon Hoe Chin from Pusing, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

Adaptive Flip Chip Bonding for Semiconductor Packages

Semiconductor package with air cavity

InventorID:

2530683 ⎘