Beaverton, Oregon
United States
16
2019-06-13
The entities that hold a legal rights for patent applications filed by inventor JACKSON James D.:
James D. JACKSON from Beaverton, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Mainboard assembly including a package overlying a die directly attached to the mainboard
#2 | 2012-09-06LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD SURFACE MOUNT COMPONENTS
#3 | 2010-03-11Mainboard assembly including a package overlying a die directly attached to the mainboard
#4 | 2009-12-17Low profile solder grid array technology for printed circuit board surface mount components
#5 | 2009-04-30Thin semiconductor device package
#6 | 2009-02-26Surface Mount Components Joined Between a Package Substrate and a Printed Circuit Board
#7 | 2007-10-18Thin semiconductor device package
#8 | 2007-04-26Method of fabricating flexible display
#9 | 2007-01-02Flexible display
#10 | 2006-02-14Electronic assembly and a method of constructing an electronic assembly
#11 | 2006-02-02Apparatus and method for optical interconnects on a carrier substrate
#12 | 2006-02-02Electro-optic surface mount light pipe and connector
#13 | 2005-09-08Apparatus and method for improving AC coupling on circuit boards
#14 | 2005-06-23Apparatuses and methods to route line to line
#15 | 2005-06-14Apparatus and method for improving AC coupling on circuit boards
#16 | 2005-03-31Electro-optic through-hole mount light pipe and connector
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