Inventor profile of:

Haobo CHEN

City:

Gilbert, Arizona

Country:

United States

Published Applications:

16

Last publication date:

2024-10-10

Top Assignees for applications by Haobo CHEN

The entities that hold a legal rights for patent applications filed by inventor CHEN Haobo:

Recent patent applications by CHEN Haobo

Haobo CHEN from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-10-10
US20240339381A1
Electricity

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER

#2 | 2024-10-03
US20240332125A1
Electricity

2D FILLERS FOR REDUCED CTE FOR PID

#3 | 2024-03-28
US20240105576A1
Electricity

DFR OVERHANG PROCESS FLOW FOR ELECTROLYTIC SURFACE FINISH FOR GLASS CORE

#4 | 2024-03-28
US20240105575A1
Electricity

ELECTROLYTIC SURFACE FINISH ARCHITECTURE

#5 | 2024-03-28
US20240105571A1
Electricity

IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS

#6 | 2024-03-14
US20240088052A1
Electricity

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

#7 | 2024-02-29
US20240071848A1
Electricity

THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES

#8 | 2024-01-04
US20240006283A1
Electricity

EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU ENABLED PACKAGES

#9 | 2023-03-23
US20230093258A1
Electricity

GLASS PATCH INTEGRATION INTO AN ELECTRONIC DEVICE PACKAGE

#10 | 2023-03-23
US20230090350A1
Electricity

LITHOGRAPHY PILLAR PROCESS FOR EMBEDDED BRIDGE SCALING

#11 | 2022-09-29
US20220310518A1
Electricity

EMBEDDED BRIDGE ARCHITECTURE WITH THINNED SURFACE

#12 | 2022-06-23
US20220196914A1
Physics

WAVEGUIDE WITH SELF-ALIGNED MIRROR IN PACKAGE FOR LONG RANGE CHIP-TO-CHIP COMMUNICATIONS

#13 | 2021-01-28
US20210028101A1
Electricity

EMBEDDED PATCH FOR LOCAL MATERIAL PROPERTY MODULATION

#14 | 2020-12-31
US20200411441A1
Electricity

LITHOGRAPHICALLY DEFINED VERTICAL INTERCONNECT ACCESS (VIA) FOR A BRIDGE DIE FIRST LEVEL INTERCONNECT (FLI)

#15 | 2020-10-01
US20200312771A1
Electricity

Patternable die attach materials and processes for patterning

#16 | 2019-07-04
US20190206781A1
Electricity

Substrate with variable height conductive and dielectric elements

InventorID:

2551831 ⎘