Andreas Bauer

City:

Regensburg

Country:

Germany

Published Applications:

Last publication date:

2024-05-02

Top Assignees for applications by Andreas Bauer

The entities that hold a legal rights for patent applications filed by inventor Bauer Andreas:

Andreas Bauer from Regensburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

CHIP WITH CRACK GUIDING STRUCTURE COMBINED WITH CRACK STOP STRUCTURE

SEMICONDUCTOR CHIP HAVING A CRACK STOP STRUCTURE

Separation of workpiece with three material removal stages

InventorID:

2558042 ⎘