Hsinchu County
Taiwan
19
2026-01-15
The entities that hold a legal rights for patent applications filed by inventor Lee Chun-Te:
Chun-Te Lee from Hsinchu County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#2 | 2025-12-25FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF
#3 | 2025-02-27FLEXIBLE CIRCUIT TAPE AND FLEXIBLE CIRCUIT BOARD THEREOF
#4 | 2024-01-11FLIP CHIP PACKAGE AND SUBSTRATE THEREOF
#5 | 2023-11-23FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF
#6 | 2023-10-12CHIP-ON-FILM PACKAGE
#7 | 2023-02-09DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD
#8 | 2023-02-09Double-sided flexible circuit board
#9 | 2022-10-13Tray
#10 | 2022-04-07Storage device for flexible circuit packages and carrier thereof
#11 | 2022-03-17Circuit board tape and joining method thereof
#12 | 2021-08-26Flexible circuit board
#13 | 2021-08-26Circuit board
#14 | 2021-06-17CIRCUIT BOARD
#15 | 2021-05-27Double-sided flexible circuit board and layout structure thereof
#16 | 2020-12-29Circuit board having a predetermined punch area and sheet separated from the same
#17 | 2019-08-15Chip on film package and flexible substrate thereof
#18 | 2019-07-11SEMICONDUCTOR DEVICE HAVING A BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#19 | 2015-11-03Substrate with bump structure and manufacturing method thereof
2558076 ⎘