Hsinchu
Taiwan
97
2025-02-27
85
2026-05-12
These are the the leading inventors for applications assigned to CHIPBOND TECHNOLOGY CORPORATION:
CHIPBOND TECHNOLOGY CORPORATION based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
FLEXIBLE CIRCUIT TAPE AND FLEXIBLE CIRCUIT BOARD THEREOF
#2 | 2025-01-30 ✅ Patent 12,564,056 granted on 2026-02-24INNER LEAD STRUCTURE OF FLEXIBLE CIRCUIT BOARD
#3 | 2024-11-21 ✅ Patent 12,543,262 granted on 2026-02-03THIN FILM CIRCUIT BOARD
#4 | 2024-11-07 ✅ Patent 12,550,764 granted on 2026-02-10LAYOUT STRUCTURE OF FLEXIBLE CIRCUIT BOARD
#5 | 2024-10-17 ✅ Patent 12,543,265 granted on 2026-02-03SEMICONDUCTOR PACKAGE AND CHIP THEREOF
#6 | 2024-06-13 ✅ Patent 12,635,586 granted on 2026-05-19SEMICONDUCTOR PACKAGE
#7 | 2024-02-29 ✅ Patent 12,317,462 granted on 2025-05-27Electronic package and method of manufacturing the same
#8 | 2024-01-11 ✅ Patent 12,456,673 granted on 2025-10-28FLIP CHIP PACKAGE AND SUBSTRATE THEREOF
#9 | 2024-01-04 ✅ Patent 12,464,639 granted on 2025-11-04SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD THEREOF
#10 | 2023-12-28 ✅ Patent 12,525,481 granted on 2026-01-13CLAMP ASSEMBLY
#11 | 2023-11-23 ✅ Patent 12,432,849 granted on 2025-09-30FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF
#12 | 2023-11-23 ✅ Patent 12,543,581 granted on 2026-02-03FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF
#13 | 2023-10-12 ✅ Patent 12,588,541 granted on 2026-03-24FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
#14 | 2023-06-15 ✅ Patent 12,538,805 granted on 2026-01-27SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#15 | 2023-06-01 ✅ Patent 12,424,551 granted on 2025-09-23SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#16 | 2023-05-25 ✅ Patent 12,412,825 granted on 2025-09-09SEMICONDUCTOR PACKAGE
#17 | 2023-05-04 ✅ Patent 12,224,183 granted on 2025-02-11Method of manufacturing semiconductor device
#18 | 2023-02-09 ✅ Patent 12,089,326 granted on 2024-09-10Double-sided flexible circuit board
#19 | 2022-11-15 ✅ Patent 11,503,698 granted on 2022-11-15Flexible circuit board and heat spreader thereof
#20 | 2022-10-20 ✅ Patent 12,224,734 granted on 2025-02-11Surface acoustic wave device and method of manufacturing the same
#21 | 2022-10-13 ✅ Patent 11,764,090 granted on 2023-09-19Tray
#22 | 2022-07-14 ✅ Patent 11,606,860 granted on 2023-03-14Flexible circuit board
#23 | 2022-04-07 ✅ Patent 11,792,923 granted on 2023-10-17Storage device for flexible circuit packages and carrier thereof
#24 | 2022-03-31 ✅ Patent 11,812,554 granted on 2023-11-07Layout structure of a flexible circuit board
#25 | 2022-03-17 ✅ Patent 11,602,047 granted on 2023-03-07Circuit board tape and joining method thereof
#26 | 2022-02-03 ✅ Patent 11,309,238 granted on 2022-04-19Layout structure of a flexible circuit board
#27 | 2022-02-03 ✅ Patent 11,651,974 granted on 2023-05-16Semiconductor package and method of fabricating the same
#28 | 2021-10-19 ✅ Patent 11,148,864 granted on 2021-10-19Storage container for electronic devices
#29 | 2021-08-26 ✅ Patent 11,178,756 granted on 2021-11-16Flexible circuit board
#30 | 2021-08-26 ✅ Patent 11,234,328 granted on 2022-01-25Circuit board
#31 | 2021-08-26 ✅ Patent 11,322,437 granted on 2022-05-03Flip chip interconnection and circuit board thereof
#32 | 2021-07-22 ✅ Patent 11,350,518 granted on 2022-05-31Method of attaching heat sinks to a circuit tape
#33 | 2021-07-01 ✅ Patent 11,581,283 granted on 2023-02-14Flip chip package and circuit board thereof
#34 | 2021-05-27 ✅ Patent 11,177,206 granted on 2021-11-16Double-sided flexible circuit board and layout structure thereof
#35 | 2021-01-14 ✅ Patent 11,522,517 granted on 2022-12-06Surface acoustic wave device and method of manufacturing the same
#36 | 2020-12-29 ✅ Patent 10,880,993 granted on 2020-12-29Circuit board having a predetermined punch area and sheet separated from the same
#37 | 2020-09-17 ✅ Patent 11,056,555 granted on 2021-07-06Semiconductor device having 3D inductor and method of manufacturing the same
#38 | 2020-07-23 ✅ Patent 11,084,684 granted on 2021-08-10Restriction device for preventing deformation of restriction plate of reel
#39 | 2020-03-19 ✅ Patent 10,797,213 granted on 2020-10-06Chip package and chip thereof
#40 | 2019-09-12 ✅ Patent 10,340,216 granted on 2019-07-02Semiconductor package and circuit substrate thereof
#41 | 2019-08-15 ✅ Patent 10,580,729 granted on 2020-03-03Chip on film package and flexible substrate thereof
#42 | 2019-06-20 ✅ Patent 10,808,331 granted on 2020-10-20Electroplating system and pressure device thereof
#43 | 2019-06-18 ✅ Patent 10,327,334 granted on 2019-06-18Layout structure of flexible circuit board
#44 | 2019-01-01 ✅ Patent 10,168,582 granted on 2019-01-01Chip package having a flexible substrate
#45 | 2018-03-29 ✅ Patent 9,929,051 granted on 2018-03-27Wafer dicing method
#46 | 2017-05-16 ✅ Patent 9,653,376 granted on 2017-05-16Heat dissipation package structure
#47 | 2017-01-19 ✅ Patent 9,961,759 granted on 2018-05-01Flexible substrate
#48 | 2016-11-29 ✅ Patent 9,508,676 granted on 2016-11-29Semiconductor package structure having hollow chamber and bottom substrate and package process thereof
#49 | 2016-08-11 ✅ Patent 9,510,441 granted on 2016-11-29Flexible substrate
#50 | 2016-01-05 ✅ Patent 9,230,823 granted on 2016-01-05Method of photoresist strip
#51 | 2015-12-10 ✅ Patent 9,247,635 granted on 2016-01-26Flexible substrate
#52 | 2015-11-03 ✅ Patent 9,177,830 granted on 2015-11-03Substrate with bump structure and manufacturing method thereof
#53 | 2015-04-02 ✅ Patent 8,981,536 granted on 2015-03-17Semiconductor structure
#54 | 2015-03-12 ✅ Patent 9,000,569 granted on 2015-04-07Semiconductor structure
#55 | 2014-08-07SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF
#56 | 2014-08-05 ✅ Patent 8,796,824 granted on 2014-08-05Semiconductor structure
#57 | 2014-06-12 ✅ Patent 8,877,629 granted on 2014-11-04Semiconductor manufacturing process and structure thereof
#58 | 2014-05-22 ✅ Patent 9,059,260 granted on 2015-06-16Semiconductor manufacturing method and semiconductor structure thereof
#59 | 2014-05-01SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE AND PACKAGE STRUCTURE THEREOF
#60 | 2014-05-01SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
#61 | 2014-04-10SEMICONDUCTOR STRUCTURE
#62 | 2014-02-06SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
#63 | 2014-02-06SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE AND PACKAGE STRUCTURE THEREOF
#64 | 2014-01-30 ✅ Patent 9,159,660 granted on 2015-10-13Semiconductor package structure and method for making the same
#65 | 2014-01-23 ✅ Patent 8,823,169 granted on 2014-09-02Semiconductor manufacturing method and semiconductor structure thereof
#66 | 2014-01-09 ✅ Patent 8,772,644 granted on 2014-07-08Carrier with three-dimensional capacitor
#67 | 2013-12-19 ✅ Patent 8,658,466 granted on 2014-02-25Semiconductor package structure and method for making the same
#68 | 2013-12-19 ✅ Patent 8,704,345 granted on 2014-04-22Semiconductor package and lead frame thereof
#69 | 2013-09-26SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF
#70 | 2013-09-26METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
#71 | 2013-09-26 ✅ Patent 8,530,344 granted on 2013-09-10Method for manufacturing fine-pitch bumps and structure thereof
#72 | 2013-09-26 ✅ Patent 8,581,384 granted on 2013-11-12Semiconductor package structure
#73 | 2013-08-22SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF
#74 | 2013-08-22 ✅ Patent 8,497,579 granted on 2013-07-30Semiconductor packaging method and structure thereof
#75 | 2013-08-22 ✅ Patent 8,841,767 granted on 2014-09-23Bumping process and structure thereof
#76 | 2013-08-06 ✅ Patent 8,501,614 granted on 2013-08-06Method for manufacturing fine-pitch bumps and structure thereof
#77 | 2013-08-01 ✅ Patent 8,658,528 granted on 2014-02-25Bumping process and structure thereof
#78 | 2013-08-01BUMPING PROCESS AND STRUCTURE THEREOF
#79 | 2013-07-25 ✅ Patent 8,581,239 granted on 2013-11-12Package structure and semiconductor structure thereof
#80 | 2013-07-18BUMPING PROCESS
#81 | 2013-07-18BUMPING PROCESS AND STRUCTURE THEREOF
#82 | 2013-05-23 ✅ Patent 8,513,772 granted on 2013-08-20Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof
#83 | 2013-04-09 ✅ Patent 8,415,243 granted on 2013-04-09Bumping process and structure thereof
#84 | 2013-03-28 ✅ Patent 8,432,017 granted on 2013-04-30Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof
#85 | 2013-03-14 ✅ Patent 8,476,159 granted on 2013-07-02Substrate structure with compliant bump and manufacturing method thereof
#86 | 2013-03-14 ✅ Patent 8,426,984 granted on 2013-04-23Substrate structure with compliant bump and manufacturing method thereof
#87 | 2013-01-31 ✅ Patent 8,963,675 granted on 2015-02-24Method for fabricating a carrier with a three dimensional inductor and structure thereof
#88 | 2013-01-24 ✅ Patent 8,450,203 granted on 2013-05-28Bumping process and structure thereof
#89 | 2013-01-03 ✅ Patent 8,347,490 granted on 2013-01-08Method for fabricating a carrier with a three dimensional inductor
#90 | 2012-12-20 ✅ Patent 8,330,280 granted on 2012-12-11Bump structure and process of manufacturing the same
#91 | 2012-12-20 ✅ Patent 8,437,142 granted on 2013-05-07Bump structure and process of manufacturing the same
#92 | 2012-12-13 ✅ Patent 8,657,125 granted on 2014-02-25Tray cleaning apparatus for electronic components
#93 | 2012-08-23 ✅ Patent 8,692,390 granted on 2014-04-08Pyramid bump structure
#94 | 2012-08-16 ✅ Patent 8,450,049 granted on 2013-05-28Process for forming an anti-oxidant metal layer on an electronic device
#95 | 2012-04-05 ✅ Patent 8,497,571 granted on 2013-07-30Thin flip chip package structure
#96 | 2009-04-23 ✅ Patent 7,953,257 granted on 2011-05-31Sliding type thin fingerprint sensor package
#97 | 2009-03-19 ✅ Patent 8,050,467 granted on 2011-11-01Package, packaging method and substrate thereof for sliding type thin fingerprint sensor
Also check out CHIPBOND TECHNOLOGY CORPORATION's (Hsinchu, Taiwan) applicant profile with 87 patent applications submitted.
5939 ⎘