Jun-su LIM

City:

Anyang-si

Country:

South Korea

Published Applications:

Last publication date:

2022-04-28

Top Assignees for applications by Jun-su LIM

The entities that hold a legal rights for patent applications filed by inventor LIM Jun-su:

SAMSUNG ELECTRONICS CO., LTD. 2 Suwon-si, South Korea
SAMSUNG ELECTRONICS CO., LTD. 1 Gyeonggi-Do, South Korea

Recent patent applications by LIM Jun-su

Jun-su LIM from Anyang-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-04-28

US20220130709A1

Electricity

Stage structure for semiconductor fabrication process, system of picking up semiconductor chip, and method of controlling tilting angle of pickup head

#2 | 2019-07-11

US20190214362A1

Electricity

Laser bonding apparatus, method of bonding semiconductor devices, and method of manufacturing semiconductor package

InventorID:

2558083 ⎘